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SN65LVDM050DR

Texas Instruments

SN65LVDM050DR by Texas Instruments

SN65LVDM050DR by Texas Instruments is a CMOS Line Transceiver with 2-bit driver and receiver. It operates at 3.3V, has differential outputs, and supports industrial temperature grade. Ideal for applications requiring high-speed data transmission over short distances.

Median Price

$3.343

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 28,360 parts In-Stock

1+ parts

$3.343

100+ parts

$2.929

1k+ parts

$1.655

10k+ parts

-

28,360

$3.343

$2.929

$1.655

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$1.655

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$1.655

-

-

-

Digiode

USA . 1,526 parts In-Stock

1+ parts

$3.176

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

$3.176

-

-

-

Vyrian

USA . 6,823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,823

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,398 parts In-Stock

1+ parts

$1.655

100+ parts

-

1k+ parts

-

10k+ parts

$1.622

3,398

$1.655

-

-

$1.622

Argo Parts USA

USA . 2,333 parts In-Stock

1+ parts

$1.655

100+ parts

-

1k+ parts

-

10k+ parts

-

2,333

$1.655

-

-

-

Ampacity Inc.

Singapore . 28,043 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

-

10k+ parts

-

28,043

$2.840

-

-

-

Corphita

USA . 3,959 parts In-Stock

1+ parts

$3.009

100+ parts

-

1k+ parts

-

10k+ parts

-

3,959

$3.009

-

-

-

Parana Technologies

USA . 1,520 parts In-Stock

1+ parts

$11.153

100+ parts

-

1k+ parts

$11.601

10k+ parts

-

1,520

$11.153

-

$11.601

-

ChromeModa Solutions

Germany . 4,013 parts In-Stock

1+ parts

$12.531

100+ parts

$10.275

1k+ parts

-

10k+ parts

-

4,013

$12.531

$10.275

-

-

IDEA Electronic Components Group

UK . 116 parts In-Stock

1+ parts

$12.531

100+ parts

$11.904

1k+ parts

$11.278

10k+ parts

-

116

$12.531

$11.904

$11.278

-

AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$17.360

100+ parts

-

1k+ parts

-

10k+ parts

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456

$17.360

-

-

-

Component Stockers USA

USA . 1,607 parts In-Stock

1+ parts

$36.950

100+ parts

-

1k+ parts

-

10k+ parts

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1,607

$36.950

-

-

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Kepictronics

USA . 2,845 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,845

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Perfect Parts

USA . 896 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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896

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DigiPath Technology Company

USA . 188 parts In-Stock

1+ parts

-

100+ parts

$11.298

1k+ parts

-

10k+ parts

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188

-

$11.298

-

-

Overview

Enhance your electronic designs with the cutting-edge SN65LVDM050DR by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments offers a wide range of applications for their line drivers & receivers, including data communication and industrial automation. This product provides customers with unparalleled value, offering high performance and efficiency in a compact and durable package. Upgrade your projects today with the SN65LVDM050DR and experience the advantages of Texas Instruments' innovative technology firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltage, making it versatile for different applications.

No. of Functions: 2

Having multiple functions in a single device increases efficiency and saves space on the PCB.

Maximum Transmit Delay: 2.7 ns

Low transmit delay ensures fast and reliable data transmission.

Output Polarity: COMPLEMENTARY

Complementary output polarity helps in reducing signal interference and improving signal integrity.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions.

Technical Specifications

Line Drivers & Receivers SN65LVDM050DR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.25 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

.02 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

27 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.7 ns

Width:

3.9 mm

Trade Compliance

SN65LVDM050DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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