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SN65LBC176ADRG4

Texas Instruments

SN65LBC176ADRG4 by Texas Instruments

SN65LBC176ADRG4 by Texas Instruments is a Line Driver & Receiver with 5V supply, 12ns max transmit delay, and 20ns max receive delay. Ideal for EIA-485-A, TIA-485-A, ISO 8482 interfaces in industrial applications requiring differential output and Schmitt trigger input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 5,500 parts In-Stock

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5,500

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Vyrian

USA . 4,508 parts In-Stock

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4,508

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Digiode

USA . 4,170 parts In-Stock

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4,170

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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One Stop Electronics

USA . 432 parts In-Stock

1+ parts

$3.500

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432

$3.500

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Parana Technologies

USA . 1,643 parts In-Stock

1+ parts

$6.281

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$7.034

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$6.281

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$7.034

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Corohmni

South Africa . 284 parts In-Stock

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$6.654

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DigiPath Technology Company

USA . 1,456 parts In-Stock

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$6.916

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$6.363

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1,456

$6.916

$6.363

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ChromeModa Solutions

Germany . 4,476 parts In-Stock

1+ parts

$7.057

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$5.787

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$7.057

$5.787

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IDEA Electronic Components Group

UK . 2,255 parts In-Stock

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$7.057

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$6.351

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$6.351

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AZTECH Wire

Italy . 527 parts In-Stock

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$12.131

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527

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$13.588

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$12.908

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$12.908

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Semicontronic

India . 782 parts In-Stock

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$31.500

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$30.712

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$30.555

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Ampacity Inc.

Singapore . 544 parts In-Stock

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$49.500

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Argo Parts USA

USA . 4,005 parts In-Stock

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Corphita

USA . 2,917 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,699 parts In-Stock

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Microchip USA

USA . 978 parts In-Stock

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978

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Continental Prestige Electronics

USA . 626 parts In-Stock

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Overview

Upgrade your communication systems with the SN65LBC176ADRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that offer reliable and efficient performance. This small outline package is perfect for industrial applications where ruggedness and reliability are key. With features like differential output and a wide operating temperature range, this device ensures seamless data transmission while maintaining low power consumption. Invest in Texas Instruments for cutting-edge technology that guarantees superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

This product's surface mount capability makes installation easy and convenient, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing its versatility and usability in various systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easy integration into existing designs, making it a practical choice for compact setups.

Maximum Transmit Delay: 12 ns

The low transmit delay ensures fast and efficient signal transmission, making this product ideal for time-sensitive applications.

Power Supplies (V): 5

With a standard power supply of 5V, this product is compatible with most systems and can easily fit into existing setups without the need for additional adjustments.

No. of Terminals: 8

The eight terminals provide ample connectivity options, allowing for easy integration into complex systems and ensuring flexibility in routing signals.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and reduces overall footprint, making it a great choice for compact designs and tight layouts.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures efficient power consumption and allows for reliable performance even under low power conditions.

Maximum High Level Input Current: 0.0001 Amp

The low input current requirement reduces power consumption and helps in maintaining efficient operation, making this product energy-efficient.

Technical Specifications

Line Drivers & Receivers SN65LBC176ADRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

12 ns

Width:

3.9 mm

Trade Compliance

SN65LBC176ADRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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