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SN65LBC175DG4

Texas Instruments

SN65LBC175DG4 by Texas Instruments

SN65LBC175DG4 by Texas Instruments is a 16-terminal Line Driver & Receiver with 4 functions. It operates at supply voltages b/w 4.75V to 5.25V, featuring a max output low current of 16A and an industrial temperature grade range from -40°C to 85°C. Ideal for V.11, EIA-422-A, EIA-423-A, and EIA-485 interface standards in various applications requiring reliable signal transmission over short distances.

Median Price

$2.132

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 127 parts In-Stock

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$2.132

10k+ parts

$2.077

127

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$2.132

$2.077

Distributors (In-Stock)

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Vyrian

USA . 6,209 parts In-Stock

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Chip Stock

USA . 3,850 parts In-Stock

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3,850

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Digiode

USA . 386 parts In-Stock

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386

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AZTECH Wire

Italy . 230 parts In-Stock

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$10.898

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Parana Technologies

USA . 1,632 parts In-Stock

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$11.396

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$11.818

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1,632

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ChromeModa Solutions

Germany . 4,335 parts In-Stock

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$12.805

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$10.500

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4,335

$12.805

$10.500

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IDEA Electronic Components Group

UK . 931 parts In-Stock

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$12.805

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$12.165

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$11.524

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931

$12.805

$12.165

$11.524

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One Stop Electronics

USA . 473 parts In-Stock

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$37.500

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Component Stockers USA

USA . 253 parts In-Stock

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$99.990

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Corphita

USA . 1,300 parts In-Stock

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Microchip USA

USA . 1,176 parts In-Stock

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DigiPath Technology Company

USA . 734 parts In-Stock

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$11.545

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Perfect Parts

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Overview

Unlock seamless communication and reliable data transmission with the SN65LBC175DG4 by Texas Instruments. Crafted with precision and expertise, this line driver & receiver offers unparalleled quality and performance. Ideal for a wide range of applications, this product ensures secure and efficient signal transmission. Experience the value of superior technology with Texas Instruments and elevate your connectivity solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product long-lasting.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving valuable space.

Maximum Supply Voltage: 5.25 V

Can handle high voltage inputs, ensuring reliable performance under various operating conditions.

No. of Functions: 4

Provides versatility and flexibility in signal processing applications.

Package Shape: RECTANGULAR

Simplifies the design and integration of the product into existing systems.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without compromising performance.

Technology: BICMOS

Combines the benefits of bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Interface Standard: V.11; EIA-422-A; EIA-423-A; EIA-485

Complies with industry standards for seamless integration with a wide range of communication systems.

Technical Specifications

Line Drivers & Receivers SN65LBC175DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

20 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

V.11; EIA-422-A; EIA-423-A; EIA-485

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

16 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN65LBC175DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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