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SN65LBC174DWR

Texas Instruments

SN65LBC174DWR by Texas Instruments

SN65LBC174DWR by Texas Instruments is a 4-function line driver with 5V supply, operating from -40 to 85°C. It features EIA-485 interface standard, BICMOS technology, and complementary output polarity. Ideal for industrial applications requiring differential outputs with a max transmit delay of 20ns.

Median Price

$4.927

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 35,233 parts In-Stock

1+ parts

$4.927

100+ parts

$4.317

1k+ parts

$2.439

10k+ parts

-

35,233

$4.927

$4.317

$2.439

-

DigiKey

USA . 1,409 parts In-Stock

1+ parts

$6.640

100+ parts

$4.306

1k+ parts

$3.884

10k+ parts

$3.803

1,409

$6.640

$4.306

$3.884

$3.803

Avnet

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.749

4,000

-

-

-

$2.749

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 196 parts In-Stock

1+ parts

$4.681

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$4.681

-

-

-

Vyrian

USA . 3,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,119

-

-

-

-

Chip Stock

USA . 2,810 parts In-Stock

1+ parts

-

100+ parts

-

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2,810

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-

-

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Resion

USA . 112 parts In-Stock

1+ parts

-

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-

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112

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 4,028 parts In-Stock

1+ parts

$2.310

100+ parts

$2.190

1k+ parts

$2.120

10k+ parts

-

4,028

$2.310

$2.190

$2.120

-

Corphita

USA . 4,313 parts In-Stock

1+ parts

$4.434

100+ parts

-

1k+ parts

-

10k+ parts

-

4,313

$4.434

-

-

-

Parana Technologies

USA . 567 parts In-Stock

1+ parts

$5.441

100+ parts

-

1k+ parts

$6.151

10k+ parts

-

567

$5.441

-

$6.151

-

ChromeModa Solutions

Germany . 5,906 parts In-Stock

1+ parts

$6.113

100+ parts

$5.013

1k+ parts

-

10k+ parts

-

5,906

$6.113

$5.013

-

-

IDEA Electronic Components Group

UK . 2,127 parts In-Stock

1+ parts

$6.113

100+ parts

-

1k+ parts

$5.502

10k+ parts

-

2,127

$6.113

-

$5.502

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Lixinc

USA . 15,644 parts In-Stock

1+ parts

-

100+ parts

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15,644

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-

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Kepictronics

USA . 3,505 parts In-Stock

1+ parts

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100+ parts

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3,505

-

-

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DigiPath Technology Company

USA . 1,258 parts In-Stock

1+ parts

-

100+ parts

$5.511

1k+ parts

-

10k+ parts

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1,258

-

$5.511

-

-

Overview

Elevate your communication systems with the SN65LBC174DWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality with their line drivers & receivers. This product offers reliable performance and efficient transmission, making it ideal for a wide range of applications. Experience seamless connectivity and high-speed data transfer with the SN65LBC174DWR, providing value, benefits, and advantages that will take your projects to the next level. Trust Texas Instruments for superior technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and improving overall functionality.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages, making it versatile for a variety of applications.

Maximum Transmit Delay: 20 ns

Provides fast transmission speeds, ensuring efficient communication within the system.

Output Characteristics: 3-STATE

Allows for tristate outputs, providing flexibility in controlling the output signals.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power consumption and high-speed operation.

Interface Standard: EIA-485

Conforms to industry standards for communication protocols, ensuring compatibility with other devices.

Technical Specifications

Line Drivers & Receivers SN65LBC174DWR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-485

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.1 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

.06 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

20 ns

Width:

7.5 mm

Trade Compliance

SN65LBC174DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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