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SN65LBC173ADG4

Texas Instruments

SN65LBC173ADG4 by Texas Instruments

SN65LBC173ADG4 by Texas Instruments is a 16-terminal Line Driver & Receiver with 5V power supply, operating b/w -40 to 85°C. It features BICMOS technology, EIA-422/TIA-422/EIA-485/TIA-485/ISO 8482 interface standards, and a max output low current of 8A. Ideal for industrial applications requiring reliable communication over short distances.

Median Price

$5.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 188 parts In-Stock

1+ parts

$6.220

100+ parts

$5.370

1k+ parts

$4.300

10k+ parts

$4.150

188

$6.220

$5.370

$4.300

$4.150

Rochester

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$4.940

1k+ parts

$4.420

10k+ parts

$4.160

25

-

$4.940

$4.420

$4.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,217 parts In-Stock

1+ parts

$3.420

100+ parts

-

1k+ parts

-

10k+ parts

-

2,217

$3.420

-

-

-

Vyrian

USA . 6,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,334

-

-

-

-

Chip Stock

USA . 3,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,330

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,107 parts In-Stock

1+ parts

$3.240

100+ parts

-

1k+ parts

-

10k+ parts

-

3,107

$3.240

-

-

-

Parana Technologies

USA . 1,306 parts In-Stock

1+ parts

$6.330

100+ parts

-

1k+ parts

$7.080

10k+ parts

-

1,306

$6.330

-

$7.080

-

ChromeModa Solutions

Germany . 5,660 parts In-Stock

1+ parts

$7.112

100+ parts

$5.832

1k+ parts

-

10k+ parts

-

5,660

$7.112

$5.832

-

-

IDEA Electronic Components Group

UK . 815 parts In-Stock

1+ parts

$7.112

100+ parts

-

1k+ parts

$6.401

10k+ parts

-

815

$7.112

-

$6.401

-

DigiPath Technology Company

USA . 796 parts In-Stock

1+ parts

-

100+ parts

$6.412

1k+ parts

-

10k+ parts

-

796

-

$6.412

-

-

Perfect Parts

USA . 74 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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74

-

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Overview

Upgrade your communication systems with the SN65LBC173ADG4 by Texas Instruments, a top-tier manufacturer known for quality and innovation in the Line Drivers & Receivers category. This versatile product offers customers unmatched reliability, efficiency, and performance. Ideal for industrial applications requiring precise data transmission, this compact and durable device guarantees seamless operation even in challenging environments. Trust Texas Instruments to deliver cutting-edge solutions that elevate your equipment to new heights of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.25 V

Supports a high maximum supply voltage, providing flexibility in power supply options for the system.

No. of Functions: 4

With multiple functions integrated into one device, it reduces the need for additional components, saving space and cost in the design.

Output Characteristics: 3-STATE

3-STATE output allows for tristate control, enabling the device to be effectively disabled or placed in a high-impedance state when not in use.

Maximum Operating Temperature: 85 °C

Capable of operating at a high temperature range, suitable for industrial applications where elevated temperatures may be encountered.

Interface Standard: EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482

Supports multiple interface standards, ensuring compatibility with a wide range of communication protocols and systems.

Technology: BICMOS

BICMOS technology offers a combination of the advantages of both bipolar and CMOS technologies, providing high speed and low power consumption.

Technical Specifications

Line Drivers & Receivers SN65LBC173ADG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Driver No. of Bits:

4

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

16 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN65LBC173ADG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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