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SN65HVD485EDGKG4

Texas Instruments

SN65HVD485EDGKG4 by Texas Instruments

SN65HVD485EDGKG4 by Texas Instruments is a Line Driver & Receiver with 5.5V max supply voltage, 30ns max transmit delay, and 200ns max receive delay. It is used in industrial applications requiring EIA-485-A/TIA-485-A interface standard compliance for differential signal transmission.

Median Price

$2.050

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.050

100+ parts

-

1k+ parts

-

10k+ parts

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50

$2.050

-

-

-

Vyrian

USA . 3,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,883

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-

-

-

Digiode

USA . 793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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793

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.009

100+ parts

-

1k+ parts

$1.929

10k+ parts

-

1,000

$2.009

-

$1.929

-

Argo Parts USA

USA . 1,494 parts In-Stock

1+ parts

$2.050

100+ parts

-

1k+ parts

-

10k+ parts

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1,494

$2.050

-

-

-

Continental Prestige Electronics

USA . 1,446 parts In-Stock

1+ parts

$2.050

100+ parts

-

1k+ parts

-

10k+ parts

$2.009

1,446

$2.050

-

-

$2.009

Parana Technologies

USA . 2,285 parts In-Stock

1+ parts

$3.604

100+ parts

-

1k+ parts

$4.120

10k+ parts

-

2,285

$3.604

-

$4.120

-

DigiPath Technology Company

USA . 2,209 parts In-Stock

1+ parts

$3.969

100+ parts

$3.651

1k+ parts

-

10k+ parts

-

2,209

$3.969

$3.651

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-

ChromeModa Solutions

Germany . 2,001 parts In-Stock

1+ parts

$4.050

100+ parts

$3.321

1k+ parts

-

10k+ parts

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2,001

$4.050

$3.321

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-

IDEA Electronic Components Group

UK . 340 parts In-Stock

1+ parts

$4.050

100+ parts

-

1k+ parts

$3.645

10k+ parts

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340

$4.050

-

$3.645

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$5.076

100+ parts

$4.822

1k+ parts

$4.822

10k+ parts

-

270

$5.076

$4.822

$4.822

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Corohmni

South Africa . 175 parts In-Stock

1+ parts

$7.571

100+ parts

-

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175

$7.571

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One Stop Electronics

USA . 547 parts In-Stock

1+ parts

$10.500

100+ parts

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547

$10.500

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$15.497

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281

$15.497

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Ampacity Inc.

Singapore . 938 parts In-Stock

1+ parts

$31.500

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938

$31.500

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Semicontronic

India . 799 parts In-Stock

1+ parts

$47.500

100+ parts

$46.312

1k+ parts

$46.075

10k+ parts

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799

$47.500

$46.312

$46.075

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Corphita

USA . 3,359 parts In-Stock

1+ parts

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3,359

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Microchip USA

USA . 218 parts In-Stock

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218

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Overview

Unlock seamless communication with the SN65HVD485EDGKG4 by Texas Instruments. Crafted with precision and expertise, Texas Instruments ensures top-notch quality in every product. As a leading manufacturer in the industry, this line driver & receiver guarantees reliable performance, making it ideal for industrial applications. With a compact design and versatile features, this product offers unmatched value to customers seeking efficient data transmission. Elevate your connectivity with the SN65HVD485EDGKG4 and experience unparalleled benefits in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and space-efficient installation on PCBs, suitable for compact electronic devices.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, making it versatile for different applications.

Maximum Transmit Delay: 30 ns

Enables fast signal transmission, crucial for maintaining efficient communication in high-speed systems.

Power Supplies (V): 5

Operates on a standard voltage supply, compatible with most electronic devices.

No. of Terminals: 8

Sufficient number of terminals for connecting multiple input and output devices, enhancing connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design saves space on the PCB, ideal for applications where board space is limited.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments with varying temperature conditions.

Output Characteristics: DIFFERENTIAL

Differential outputs provide noise immunity and improved signal integrity, making the product reliable in noisy environments.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power consumption and high-speed performance, ensuring reliable operation.

Technical Specifications

Line Drivers & Receivers SN65HVD485EDGKG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

200 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

30 ns

Width:

3 mm

Trade Compliance

SN65HVD485EDGKG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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