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SN65HVD30DRG4

Texas Instruments

SN65HVD30DRG4 by Texas Instruments

SN65HVD30DRG4 by Texas Instruments is a Line Transceiver with 3.3V power supply, 18ns max transmit delay, and EIA-422-B interface standard. Ideal for industrial applications requiring differential Schmitt trigger input characteristics and complementary output polarity in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 17,440 parts In-Stock

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Vyrian

USA . 8,337 parts In-Stock

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8,337

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Digiode

USA . 2,585 parts In-Stock

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2,585

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 1,241 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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-

1,241

$2.500

$2.438

$2.425

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Corohmni

South Africa . 234 parts In-Stock

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$2.820

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234

$2.820

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Parana Technologies

USA . 926 parts In-Stock

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$7.356

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$7.849

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926

$7.356

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$7.849

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DigiPath Technology Company

USA . 1,455 parts In-Stock

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$8.100

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$8.100

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ChromeModa Solutions

Germany . 6,429 parts In-Stock

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$8.265

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$6.777

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$8.265

$6.777

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IDEA Electronic Components Group

UK . 447 parts In-Stock

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$8.265

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$7.438

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447

$8.265

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$7.438

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Ampacity Inc.

Singapore . 756 parts In-Stock

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$10.500

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$12.715

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$12.080

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$12.080

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200

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$12.080

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AZTECH Wire

Italy . 204 parts In-Stock

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$15.809

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One Stop Electronics

USA . 793 parts In-Stock

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$38.500

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Lixinc

USA . 12,690 parts In-Stock

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Continental Prestige Electronics

USA . 6,504 parts In-Stock

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Argo Parts USA

USA . 4,962 parts In-Stock

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Kepictronics

USA . 3,200 parts In-Stock

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Microchip USA

USA . 2,766 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Corphita

USA . 664 parts In-Stock

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Overview

Experience seamless and reliable communication with the SN65HVD30DRG4 Line Driver & Receiver by Texas Instruments. Renowned for their top-notch quality and cutting-edge technology, Texas Instruments delivers unparalleled performance in the industry. Ideal for industrial applications requiring precise data transmission, this product offers a compact design, low power consumption, and high-speed operation. Trust Texas Instruments to provide you with the best-in-class solutions for all your communication needs. Elevate your system performance with the SN65HVD30DRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components of the line driver and receiver.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, making it suitable for compact designs and automated assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources, increasing the versatility of the product.

Maximum Transmit Delay: 18 ns

The low maximum transmit delay of 18 ns ensures fast transmission of signals, making it ideal for applications that require real-time data delivery.

Power Supplies (V): 3.3

The use of 3.3 V power supplies is common in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for designs with limited board real estate.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product can withstand harsh operating conditions, making it suitable for use in industrial environments.

Interface Standard: EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

Compliance with multiple interface standards ensures interoperability with a variety of communication protocols, making it a versatile solution for different applications.

Technical Specifications

Line Drivers & Receivers SN65HVD30DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE 25MBPS

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

45 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

18 ns

Width:

3.9 mm

Trade Compliance

SN65HVD30DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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