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SN65HVD3088EDGKRG4

Texas Instruments

SN65HVD3088EDGKRG4 by Texas Instruments

SN65HVD3088EDGKRG4 by Texas Instruments is a CMOS line transceiver with EIA-485-A interface standard. It operates at 5V, has a max supply voltage of 5.5V, and offers differential output. With a small outline package style, it is ideal for industrial applications requiring reliable communication over long distances.

Median Price

$2.300

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 26,960 parts In-Stock

1+ parts

-

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-

1k+ parts

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26,960

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Vyrian

USA . 8,875 parts In-Stock

1+ parts

-

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-

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8,875

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-

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Digiode

USA . 1,879 parts In-Stock

1+ parts

-

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1,879

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-

-

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Bristol Electronics

USA . 1,485 parts In-Stock

1+ parts

-

100+ parts

$2.300

1k+ parts

$2.021

10k+ parts

-

1,485

-

$2.300

$2.021

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Microfarads

USA . 1,433 parts In-Stock

1+ parts

-

100+ parts

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1,433

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Nova Conductors

Japan . 98 parts In-Stock

1+ parts

-

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98

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 205 parts In-Stock

1+ parts

$2.839

100+ parts

-

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205

$2.839

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-

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Parana Technologies

USA . 1,388 parts In-Stock

1+ parts

$3.417

100+ parts

-

1k+ parts

$3.942

10k+ parts

-

1,388

$3.417

-

$3.942

-

DigiPath Technology Company

USA . 690 parts In-Stock

1+ parts

$3.762

100+ parts

$3.461

1k+ parts

-

10k+ parts

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690

$3.762

$3.461

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-

ChromeModa Solutions

Germany . 3,956 parts In-Stock

1+ parts

$3.839

100+ parts

$3.148

1k+ parts

-

10k+ parts

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3,956

$3.839

$3.148

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

1+ parts

$3.839

100+ parts

-

1k+ parts

$3.455

10k+ parts

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1,888

$3.839

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$3.455

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AZTECH Wire

Italy . 646 parts In-Stock

1+ parts

$5.489

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646

$5.489

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Ampacity Inc.

Singapore . 870 parts In-Stock

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$42.500

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870

$42.500

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One Stop Electronics

USA . 698 parts In-Stock

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$42.500

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698

$42.500

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Semicontronic

India . 319 parts In-Stock

1+ parts

$46.500

100+ parts

$45.338

1k+ parts

$45.105

10k+ parts

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319

$46.500

$45.338

$45.105

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Corphita

USA . 4,154 parts In-Stock

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4,154

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Advanced Electronics

New Zealand . 3,638 parts In-Stock

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3,638

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Argo Parts USA

USA . 1,714 parts In-Stock

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1,714

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Continental Prestige Electronics

USA . 535 parts In-Stock

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535

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Microchip USA

USA . 277 parts In-Stock

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277

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Bastille Electronics

Australia . 16 parts In-Stock

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16

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Overview

Unlock seamless communication and reliable data transmission with the SN65HVD3088EDGKRG4 by Texas Instruments. Crafted with precision and expertise, this line driver & receiver offers unparalleled quality and performance. From industrial automation to automotive applications, this versatile product ensures optimal signal integrity and efficiency. Experience peace of mind knowing that your communication needs are in capable hands with Texas Instruments. Elevate your projects with the SN65HVD3088EDGKRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving space and reducing manufacturing cost.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility and compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape simplifies PCB layout and contributes to a compact design.

Maximum Transmit Delay: 20 ns

The low maximum transmit delay ensures fast signal transmission, suitable for high-speed applications.

Output Characteristics: DIFFERENTIAL

The differential output enhances noise immunity and signal integrity, making it suitable for noisy environments.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Interface Standard: EIA-485-A; TIA-485-A

Compliance with industry standards ensures interoperability and compatibility with other devices using the same interface standard.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Line Drivers & Receivers SN65HVD3088EDGKRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

100 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

20 ns

Width:

3 mm

Trade Compliance

SN65HVD3088EDGKRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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