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SN65HVD3082EDG4

Texas Instruments

SN65HVD3082EDG4 by Texas Instruments

SN65HVD3082EDG4 by Texas Instruments is an EIA-485-A/TIA-485-A line transceiver with 8 terminals and CMOS technology. It operates at a supply voltage range of 4.5V to 5.5V, with a max transmit delay of 1300ns and max receive delay of 200ns. Ideal for industrial applications requiring differential output and true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,893 parts In-Stock

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Digiode

USA . 3,004 parts In-Stock

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Nova Conductors

Japan . 57 parts In-Stock

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ComSIT Distribution GmbH

Germany . 18 parts In-Stock

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ComSIT USA

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Semicontronic

India . 136 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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136

$4.500

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$4.365

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Corohmni

South Africa . 490 parts In-Stock

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$5.368

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490

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$6.067

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$5.763

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$5.763

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40

$6.067

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$5.763

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AZTECH Wire

Italy . 484 parts In-Stock

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$10.485

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Parana Technologies

USA . 1,863 parts In-Stock

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$12.780

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$13.248

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DigiPath Technology Company

USA . 1,549 parts In-Stock

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$14.073

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ChromeModa Solutions

Germany . 4,950 parts In-Stock

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$14.360

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$14.360

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IDEA Electronic Components Group

UK . 1,314 parts In-Stock

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$14.360

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$13.642

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$12.924

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One Stop Electronics

USA . 304 parts In-Stock

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$14.500

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Ampacity Inc.

Singapore . 196 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Eliminating Global Boundries, Inc

USA . 450 parts In-Stock

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Microchip USA

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$0.907

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Bastille Electronics

Australia . 120 parts In-Stock

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Perfect Parts

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Overview

Experience seamless communication with the SN65HVD3082EDG4 by Texas Instruments. Crafted with precision and quality, this line driver & receiver offers reliable performance in various applications. From industrial automation to automotive systems, this versatile product ensures efficient data transmission with minimal delay. Trust in Texas Instruments' reputation for excellence and invest in the SN65HVD3082EDG4 for unparalleled value and benefits. Upgrade your communication systems today and experience the difference with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the product, making it suitable for various environments.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with different systems.

Maximum Transmit Delay: 1300 ns

The low transmit delay ensures fast and efficient data transmission, making the product ideal for real-time applications.

Power Supplies (V): 5

The 5V power supply is a common and widely available voltage, making it easy to integrate into existing systems.

Output Characteristics: DIFFERENTIAL

Differential output provides better noise immunity and signal integrity, making the product suitable for high-speed communication.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Interface Standard: EIA-485-A; TIA-485-A

Compliance with industry standards ensures interoperability and compatibility with a wide range of devices and systems.

Technical Specifications

Line Drivers & Receivers SN65HVD3082EDG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

200 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

1300 ns

Width:

3.9 mm

Trade Compliance

SN65HVD3082EDG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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