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SN65HVD1792TDREP

Texas Instruments

SN65HVD1792TDREP by Texas Instruments

SN65HVD1792TDREP by Texas Instruments is a Line Transceiver with 5V nominal voltage, 200ns max transmit delay, and -40 to 105°C operating temperature range. Ideal for industrial applications requiring differential output and complementary polarity in a compact rectangular package.

Median Price

$7.310

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 23,840 parts In-Stock

1+ parts

$7.310

100+ parts

$5.960

1k+ parts

$3.973

10k+ parts

-

23,840

$7.310

$5.960

$3.973

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.973

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$3.973

-

-

-

Digiode

USA . 522 parts In-Stock

1+ parts

$6.944

100+ parts

-

1k+ parts

-

10k+ parts

-

522

$6.944

-

-

-

Vyrian

USA . 3,602 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,602

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 50 parts In-Stock

1+ parts

$3.894

100+ parts

-

1k+ parts

$3.738

10k+ parts

-

50

$3.894

-

$3.738

-

Continental Prestige Electronics

USA . 4,768 parts In-Stock

1+ parts

$3.973

100+ parts

-

1k+ parts

-

10k+ parts

$3.894

4,768

$3.973

-

-

$3.894

Argo Parts USA

USA . 2,316 parts In-Stock

1+ parts

$3.973

100+ parts

-

1k+ parts

-

10k+ parts

-

2,316

$3.973

-

-

-

Semicontronic

India . 23,774 parts In-Stock

1+ parts

$6.210

100+ parts

$6.055

1k+ parts

$6.024

10k+ parts

-

23,774

$6.210

$6.055

$6.024

-

Ampacity Inc.

Singapore . 23,589 parts In-Stock

1+ parts

$6.210

100+ parts

-

1k+ parts

-

10k+ parts

-

23,589

$6.210

-

-

-

Corphita

USA . 1,085 parts In-Stock

1+ parts

$6.579

100+ parts

-

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-

10k+ parts

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1,085

$6.579

-

-

-

AZTECH Wire

Italy . 971 parts In-Stock

1+ parts

$8.450

100+ parts

-

1k+ parts

-

10k+ parts

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971

$8.450

-

-

-

Parana Technologies

USA . 1,003 parts In-Stock

1+ parts

$8.597

100+ parts

$798.399

1k+ parts

$7.738

10k+ parts

-

1,003

$8.597

$798.399

$7.738

-

Aztec Data Supply Inc.

USA . 2,999 parts In-Stock

1+ parts

$9.150

100+ parts

-

1k+ parts

-

10k+ parts

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2,999

$9.150

-

-

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DigiPath Technology Company

USA . 1,613 parts In-Stock

1+ parts

$9.467

100+ parts

$8.709

1k+ parts

-

10k+ parts

-

1,613

$9.467

$8.709

-

-

IDEA Electronic Components Group

UK . 2,019 parts In-Stock

1+ parts

$9.660

100+ parts

$9.177

1k+ parts

$8.694

10k+ parts

-

2,019

$9.660

$9.177

$8.694

-

ChromeModa Solutions

Germany . 1,248 parts In-Stock

1+ parts

$9.660

100+ parts

$7.921

1k+ parts

-

10k+ parts

-

1,248

$9.660

$7.921

-

-

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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900

-

-

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-

Overview

Discover the power of seamless communication with the SN65HVD1792TDREP by Texas Instruments. Crafted with precision and reliability, this line driver & receiver offers unparalleled performance in industrial applications. With a compact design and advanced features like differential output and complementary polarity, this product is designed to optimize efficiency and accuracy. Trust in Texas Instruments' legacy of excellence and elevate your projects with the SN65HVD1792TDREP. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components, making the product durable and reliable.

Surface Mount: YES

Surface mount capability makes it easy to integrate the product onto circuit boards, saving space and reducing assembly time.

Maximum Transmit Delay: 200 ns

Low transmit delay ensures fast and efficient signal transmission, critical for high-speed communication systems.

Maximum Operating Temperature: 105 °C

High operating temperature range makes the product suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the product can operate in extreme cold conditions, enhancing its versatility.

Output Characteristics: DIFFERENTIAL

Differential output provides better noise immunity and signal integrity, making the product ideal for long-distance communication.

Technical Specifications

Line Drivers & Receivers SN65HVD1792TDREP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

4 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

200 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

6 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

200 ns

Width:

3.91 mm

Trade Compliance

SN65HVD1792TDREP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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