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SN65HVD1176DRG4

Texas Instruments

SN65HVD1176DRG4 by Texas Instruments

SN65HVD1176DRG4 by Texas Instruments is a line driver/receiver with 5V supply voltage, 10ns max transmit delay, and -40 to 85°C operating temperature. It features differential output, EIA-485-A interface standard, and is ideal for industrial applications requiring reliable communication over long distances.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 49,420 parts In-Stock

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49,420

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Vyrian

USA . 3,799 parts In-Stock

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3,799

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Digiode

USA . 1,265 parts In-Stock

1+ parts

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1,265

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Nova Conductors

Japan . 93 parts In-Stock

1+ parts

-

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93

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 91 parts In-Stock

1+ parts

$10.450

100+ parts

-

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91

$10.450

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Parana Technologies

USA . 821 parts In-Stock

1+ parts

$10.551

100+ parts

-

1k+ parts

$11.055

10k+ parts

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821

$10.551

-

$11.055

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Ampacity Inc.

Singapore . 1,568 parts In-Stock

1+ parts

$11.500

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-

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1,568

$11.500

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$11.643

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744

$11.643

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ChromeModa Solutions

Germany . 4,556 parts In-Stock

1+ parts

$11.855

100+ parts

$9.721

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4,556

$11.855

$9.721

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IDEA Electronic Components Group

UK . 23 parts In-Stock

1+ parts

$11.855

100+ parts

$11.262

1k+ parts

$10.670

10k+ parts

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23

$11.855

$11.262

$10.670

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$12.502

100+ parts

$11.877

1k+ parts

$11.877

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60

$12.502

$11.877

$11.877

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Semicontronic

India . 970 parts In-Stock

1+ parts

$24.500

100+ parts

$23.888

1k+ parts

$23.765

10k+ parts

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970

$24.500

$23.888

$23.765

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One Stop Electronics

USA . 845 parts In-Stock

1+ parts

$38.500

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845

$38.500

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Microchip USA

USA . 12,534 parts In-Stock

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12,534

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Continental Prestige Electronics

USA . 5,650 parts In-Stock

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Corphita

USA . 3,156 parts In-Stock

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3,156

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DigiPath Technology Company

USA . 2,148 parts In-Stock

1+ parts

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$10.688

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2,148

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$10.688

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Modulus Dynamics

Lithuania . 1,000 parts In-Stock

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1,000

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Argo Parts USA

USA . 354 parts In-Stock

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354

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Overview

Discover the cutting-edge technology of the Texas Instruments SN65HVD1176DRG4, a top-of-the-line line driver and receiver that guarantees high-quality performance in industrial applications. With a robust design and reliable manufacturing by Texas Instruments, this product ensures seamless communication and data transmission with maximum efficiency. Experience the benefits of quick transmit and receive delays, differential output, and EIA-485-A interface standard compatibility. Trust in the SN65HVD1176DRG4 for all your industrial needs and witness unparalleled value and advantages that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the inner components of the product, ensuring a longer lifespan.

Maximum Supply Voltage: 5.25 V

This high maximum supply voltage allows for versatile application in various systems without the risk of electrical damage.

Maximum Transmit Delay: 10 ns

With a low transmit delay, this product can quickly and efficiently transmit data, making it suitable for real-time applications.

Output Characteristics: DIFFERENTIAL

The differential output allows for noise rejection and improved signal integrity, making this product reliable in noisy environments.

Technology: BICMOS

Utilizing BICMOS technology offers a balance between performance and power efficiency, making this product a smart choice for energy-conscious applications.

Interface Standard: EIA-485-A; TIA-485-A

Compliance with these interface standards ensures compatibility with a wide range of devices and facilitates easy integration into existing systems.

Technical Specifications

Line Drivers & Receivers SN65HVD1176DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2.1 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

.1 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

10 ns

Width:

3.9 mm

Trade Compliance

SN65HVD1176DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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