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SN65HVD10P

Texas Instruments

SN65HVD10P by Texas Instruments

SN65HVD10P by Texas Instruments is an 8-terminal line driver with a max supply voltage of 3.6V and operating temperature range of -40 to 85°C. It features differential output, EIA-485-A interface standard, and BICMOS technology, making it ideal for industrial applications requiring reliable data transmission over long distances.

Median Price

$4.898

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,836 parts In-Stock

1+ parts

$4.898

100+ parts

$3.993

1k+ parts

$2.662

10k+ parts

-

2,836

$4.898

$3.993

$2.662

-

Mouser Electronics

USA . 293 parts In-Stock

1+ parts

$6.330

100+ parts

$4.090

1k+ parts

$3.660

10k+ parts

-

293

$6.330

$4.090

$3.660

-

DigiKey

USA . 753 parts In-Stock

1+ parts

$7.190

100+ parts

$4.683

1k+ parts

$4.232

10k+ parts

-

753

$7.190

$4.683

$4.232

-

Rochester

USA . 152 parts In-Stock

1+ parts

-

100+ parts

$3.330

1k+ parts

$2.980

10k+ parts

$2.800

152

-

$3.330

$2.980

$2.800

Verical

USA . 152 parts In-Stock

1+ parts

-

100+ parts

$4.150

1k+ parts

$3.712

10k+ parts

$3.487

152

-

$4.150

$3.712

$3.487

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,233 parts In-Stock

1+ parts

$3.515

100+ parts

-

1k+ parts

-

10k+ parts

-

3,233

$3.515

-

-

-

Vyrian

USA . 2,186 parts In-Stock

1+ parts

$3.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2,186

$3.700

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,142 parts In-Stock

1+ parts

$3.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,142

$3.330

-

-

-

Parana Technologies

USA . 2,068 parts In-Stock

1+ parts

$12.932

100+ parts

-

1k+ parts

$13.419

10k+ parts

-

2,068

$12.932

-

$13.419

-

DigiPath Technology Company

USA . 363 parts In-Stock

1+ parts

$14.239

100+ parts

$13.100

1k+ parts

-

10k+ parts

-

363

$14.239

$13.100

-

-

ChromeModa Solutions

Germany . 1,878 parts In-Stock

1+ parts

$14.530

100+ parts

$11.915

1k+ parts

-

10k+ parts

-

1,878

$14.530

$11.915

-

-

IDEA Electronic Components Group

UK . 1,808 parts In-Stock

1+ parts

$14.530

100+ parts

$13.804

1k+ parts

$13.077

10k+ parts

-

1,808

$14.530

$13.804

$13.077

-

A-Z Elektronik GmbH

Germany . 14,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,736

-

-

-

-

Perfect Parts

USA . 144 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

144

-

-

-

-

Overview

Enhancing connectivity and communication, the Texas Instruments SN65HVD10P line driver/receiver is a top-quality solution for your networking needs. With a reputation for reliability and innovation, Texas Instruments delivers excellence in every product. Ideal for industrial applications requiring precise data transmission, this versatile component offers exceptional value with its high-performance capabilities. Trust the SN65HVD10P to provide seamless integration and superior functionality, setting the standard for efficiency in line drivers and receivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, increasing versatility in applications.

Maximum Transmit Delay: 16 ns

Ensures fast and efficient transmission of data, making this product suitable for real-time applications.

Output Characteristics: DIFFERENTIAL

Enables reliable data transmission over long distances by minimizing noise and signal degradation.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, resulting in low power consumption and high speed performance.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Compliance with industry standards ensures seamless integration with existing systems and compatibility with various devices.

Technical Specifications

Line Drivers & Receivers SN65HVD10P attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE 32 MBPS

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

1

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

16 ns

Width:

7.62 mm

Trade Compliance

SN65HVD10P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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