Loading...

SN65HVD06DG4

Texas Instruments

SN65HVD06DG4 by Texas Instruments

SN65HVD06DG4 by Texas Instruments is a Line Driver & Receiver with 5.5V max supply voltage, 40ns max transmit delay, and 70ns max receive delay. Ideal for EIA-485-A, TIA-485-A, ISO 8482E interface standards in industrial applications requiring BICMOS technology for reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,245

-

-

-

-

Digiode

USA . 1,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,356

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 40 parts In-Stock

1+ parts

$3.625

100+ parts

-

1k+ parts

$4.137

10k+ parts

-

40

$3.625

-

$4.137

-

ChromeModa Solutions

Germany . 3,415 parts In-Stock

1+ parts

$4.073

100+ parts

$3.340

1k+ parts

-

10k+ parts

-

3,415

$4.073

$3.340

-

-

IDEA Electronic Components Group

UK . 792 parts In-Stock

1+ parts

$4.073

100+ parts

-

1k+ parts

$3.666

10k+ parts

-

792

$4.073

-

$3.666

-

One Stop Electronics

USA . 1,136 parts In-Stock

1+ parts

$14.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,136

$14.500

-

-

-

AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$17.509

100+ parts

-

1k+ parts

-

10k+ parts

-

737

$17.509

-

-

-

Corphita

USA . 1,165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,165

-

-

-

-

DigiPath Technology Company

USA . 988 parts In-Stock

1+ parts

-

100+ parts

$3.672

1k+ parts

-

10k+ parts

-

988

-

$3.672

-

-

Microchip USA

USA . 214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

214

-

-

-

-

Overview

Upgrade your communication systems with the SN65HVD06DG4 by Texas Instruments. Known for their top-quality products, Texas Instruments offers a reliable solution for Line Drivers & Receivers. This versatile component, with its advanced technology and industrial-grade performance, is perfect for various applications. With a compact design, high-speed transmission, and low power consumption, this line transceiver ensures seamless data exchange while maintaining signal integrity. Trust Texas Instruments to deliver excellence in every product, providing you with the value and peace of mind you deserve. Elevate your projects with the SN65HVD06DG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes installation of this product quick and easy, saving time for the user.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this product can handle a wide range of power inputs, providing flexibility in usage.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high impedance when not transmitting data, reducing power consumption and signal interference.

Differential Output: YES

Having a differential output helps in reducing noise and improving signal quality over long transmission distances, making this product suitable for industrial applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance under varying conditions.

Technology: BICMOS

The BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed operation and low power consumption, making this product efficient and reliable.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482E

Compliance with industry standards ensures compatibility with a wide range of communication systems, making this product a versatile choice for different applications.

Technical Specifications

Line Drivers & Receivers SN65HVD06DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE UPTO 10 MBPS

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

.1 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

40 ns

Width:

3.9 mm

Trade Compliance

SN65HVD06DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 21