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SN65C1406D

Texas Instruments

SN65C1406D by Texas Instruments

SN65C1406D by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at -40 to 85°C. It has a max supply voltage of 15V and can handle power supplies of ±5/±12V. Ideal for industrial applications requiring EIA-232-F, TIA-232-F, V.28 interface standards.

Median Price

$4.875

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 222 parts In-Stock

1+ parts

-

100+ parts

$3.900

1k+ parts

$3.490

10k+ parts

$3.290

222

-

$3.900

$3.490

$3.290

DigiKey

USA . 222 parts In-Stock

1+ parts

-

100+ parts

$5.140

1k+ parts

-

10k+ parts

-

222

-

$5.140

-

-

Verical

USA . 99 parts In-Stock

1+ parts

-

100+ parts

$4.875

1k+ parts

$4.362

10k+ parts

$4.112

99

-

$4.875

$4.362

$4.112

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,745 parts In-Stock

1+ parts

$3.116

100+ parts

-

1k+ parts

-

10k+ parts

-

3,745

$3.116

-

-

-

Vyrian

USA . 7,472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,472

-

-

-

-

DigiKey Marketplace

USA . 741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

741

-

-

-

-

Beltway Electronics Company

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,419 parts In-Stock

1+ parts

$2.952

100+ parts

-

1k+ parts

-

10k+ parts

-

2,419

$2.952

-

-

-

Parana Technologies

USA . 966 parts In-Stock

1+ parts

$4.250

100+ parts

-

1k+ parts

$4.683

10k+ parts

-

966

$4.250

-

$4.683

-

DigiPath Technology Company

USA . 295 parts In-Stock

1+ parts

$4.680

100+ parts

$4.305

1k+ parts

-

10k+ parts

-

295

$4.680

$4.305

-

-

ChromeModa Solutions

Germany . 2,422 parts In-Stock

1+ parts

$4.775

100+ parts

$3.916

1k+ parts

-

10k+ parts

-

2,422

$4.775

$3.916

-

-

IDEA Electronic Components Group

UK . 399 parts In-Stock

1+ parts

$4.775

100+ parts

-

1k+ parts

$4.298

10k+ parts

-

399

$4.775

-

$4.298

-

A-Z Elektronik GmbH

Germany . 1,163 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,163

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Perfect Parts

USA . 712 parts In-Stock

1+ parts

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100+ parts

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712

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Overview

Enhance your communication systems with the SN65C1406D by Texas Instruments. This reliable line driver/receiver offers top-notch quality and performance, thanks to the expertise of its manufacturer. Ideal for industrial applications, this compact device provides seamless data transmission while ensuring minimal power consumption. With its inverted output polarity and Schmitt trigger input characteristics, the SN65C1406D is a versatile solution that delivers value and efficiency to customers looking to optimize their operations. Elevate your connectivity with this innovative technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making this product a reliable choice for long-term use.

Surface Mount: YES

The surface mount capability allows for easy installation and compact design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 6 V

With a maximum supply voltage of 6V, this product offers a wide range of compatibility with various power sources, enhancing its versatility.

No. of Functions: 3

Having multiple functions in a single device simplifies the circuit design, reduces component count, and improves overall system efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing system layouts and facilitates efficient PCB design.

Maximum Transmit Delay: 3500 ns

The low transmit delay ensures fast signal propagation, reducing latency and enhancing the overall performance of the communication system.

Power Supplies (V): 5,+-5/+-12

The multiple power supply options provide flexibility in voltage requirements, allowing for compatibility with a range of power sources and system configurations.

No. of Terminals: 16

The high number of terminals allows for a more complex and versatile connection scheme, accommodating a wide range of input and output configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices where size is a critical factor.

Maximum High Level Input Current: 0.000001 Amp

The low input current requirement minimizes power consumption and reduces heat dissipation, contributing to energy efficiency and longer device lifespan.

Output Characteristics: TOTEM-POLE

The totem-pole output configuration provides both sourcing and sinking capabilities, ensuring robust and reliable signal transmission in various operating conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable operation in harsh environments, making this product suitable for industrial and outdoor applications.

Terminal Position: DUAL

The dual terminal position offers versatility in board mounting options, allowing for easy integration into different system layouts and configurations.

Technology: BIMOS

The combination of bipolar and MOS technology provides high-speed performance and low power consumption, resulting in efficient signal processing and reduced heat generation.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry interface standards ensures interoperability with a wide range of devices and systems, making this product a versatile and reliable choice for communication applications.

Technical Specifications

Line Drivers & Receivers SN65C1406D attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

8 V

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

3.2 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,+-5/+-12

Qualification:

Not Qualified

Maximum Receive Delay:

4000 ns

Receiver No. of Bits:

3

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.45 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

15 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Technology:

BIMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

3500 ns

Width:

3.9 mm

Trade Compliance

SN65C1406D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-493-7597, 5962014937597

NIIN

014937597

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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