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SN65C1168NSRG4

Texas Instruments

SN65C1168NSRG4 by Texas Instruments

SN65C1168NSRG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 5V. It features a max transmit delay of 12ns and can handle up to 6A output low current. Ideal for industrial applications requiring EIA-422-B, TIA-422-B, or V.11 interface standards in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,300 parts In-Stock

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7,300

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Vyrian

USA . 6,184 parts In-Stock

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6,184

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Digiode

USA . 3,605 parts In-Stock

1+ parts

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3,605

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,241 parts In-Stock

1+ parts

$2.500

100+ parts

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1,241

$2.500

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Corohmni

South Africa . 152 parts In-Stock

1+ parts

$2.991

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152

$2.991

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Parana Technologies

USA . 1,817 parts In-Stock

1+ parts

$3.289

100+ parts

-

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$3.813

10k+ parts

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1,817

$3.289

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$3.813

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DigiPath Technology Company

USA . 1,723 parts In-Stock

1+ parts

$3.621

100+ parts

$3.331

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-

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1,723

$3.621

$3.331

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ChromeModa Solutions

Germany . 5,368 parts In-Stock

1+ parts

$3.695

100+ parts

$3.030

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5,368

$3.695

$3.030

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IDEA Electronic Components Group

UK . 2,284 parts In-Stock

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$3.695

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$3.326

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2,284

$3.695

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$3.326

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AZTECH Wire

Italy . 313 parts In-Stock

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$6.318

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313

$6.318

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Semicontronic

India . 1,358 parts In-Stock

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$29.500

100+ parts

$28.762

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$28.615

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1,358

$29.500

$28.762

$28.615

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Ampacity Inc.

Singapore . 582 parts In-Stock

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$49.500

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582

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Microchip USA

USA . 3,283 parts In-Stock

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Corphita

USA . 2,387 parts In-Stock

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Continental Prestige Electronics

USA . 2,309 parts In-Stock

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Argo Parts USA

USA . 1,595 parts In-Stock

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1,595

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock the power of seamless communication with the SN65C1168NSRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their line drivers & receivers. Ideal for industrial applications, this product offers customers unparalleled value with its efficient operation and robust design. Experience the benefits of smooth signal transmission and enhanced performance with the SN65C1168NSRG4. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

The surface mount technology allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can withstand voltage fluctuations and provide stable performance in diverse electrical systems.

No. of Functions: 2

Having multiple functions in a single device increases efficiency and reduces the need for additional components, simplifying circuit design.

Maximum Transmit Delay: 12 ns

The low transmit delay ensures fast data transmission, making it suitable for applications where real-time data processing is crucial.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing systems or PCB layouts, optimizing space utilization.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can operate efficiently in harsh environmental conditions without compromising performance.

Output Characteristics: 3-STATE

The 3-state output allows for flexible signal control, enabling the device to drive multiple loads or tri-state bus systems effectively.

Technology: BICMOS

The BiCMOS technology combines the benefits of bipolar and CMOS technologies, offering high speed, low power consumption, and robust performance.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compatibility with multiple interface standards ensures seamless integration with a wide range of communication systems, enhancing versatility.

Technical Specifications

Line Drivers & Receivers SN65C1168NSRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

RECEIVER 3-STATE OUTPUTS

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

6 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

27 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

5.3 mm

Trade Compliance

SN65C1168NSRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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