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SN65C1167NSRG4

Texas Instruments

SN65C1167NSRG4 by Texas Instruments

SN65C1167NSRG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at temperatures from -40 to 85°C. It features a max supply voltage of 7V and a transmit delay of 12ns. Ideal for industrial applications requiring EIA-422-B, TIA-422-B, or V.11 interface standards in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,595 parts In-Stock

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3,595

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Chip Stock

USA . 3,370 parts In-Stock

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3,370

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Vyrian

USA . 2,469 parts In-Stock

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2,469

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Nova Conductors

Japan . 23 parts In-Stock

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23

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Distributors (Availability)

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AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$5.278

100+ parts

-

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737

$5.278

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Parana Technologies

USA . 1,275 parts In-Stock

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$10.287

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$10.815

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1,275

$10.287

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$10.815

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DigiPath Technology Company

USA . 753 parts In-Stock

1+ parts

$11.327

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753

$11.327

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ChromeModa Solutions

Germany . 4,139 parts In-Stock

1+ parts

$11.558

100+ parts

$9.478

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4,139

$11.558

$9.478

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IDEA Electronic Components Group

UK . 1,350 parts In-Stock

1+ parts

$11.558

100+ parts

$10.980

1k+ parts

$10.402

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1,350

$11.558

$10.980

$10.402

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Ampacity Inc.

Singapore . 1,545 parts In-Stock

1+ parts

$34.500

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1,545

$34.500

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One Stop Electronics

USA . 662 parts In-Stock

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$41.500

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662

$41.500

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Corphita

USA . 3,893 parts In-Stock

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3,893

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Microchip USA

USA . 1,516 parts In-Stock

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1,516

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Perfect Parts

USA . 687 parts In-Stock

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687

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience seamless and reliable data transmission with the Texas Instruments SN65C1167NSRG4 Line Driver & Receiver. Crafted with precision using high-quality materials, this product offers unparalleled performance in a compact package. Ideal for industrial applications, this versatile device ensures efficient signal transfer with minimal delay, making it a valuable asset for your projects. Trust in Texas Instruments to deliver superior quality and innovative solutions that will elevate your work to new heights. Choose the SN65C1167NSRG4 for exceptional results every time.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and can withstand harsh environments, making it a reliable choice for various applications.

Surface Mount:

YES - The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Maximum Supply Voltage:

7 V - With a high maximum supply voltage, this product can handle a wide range of power sources, increasing its versatility.

No. of Functions:

2 - Having multiple functions in one device simplifies circuit design and reduces the need for additional components, saving costs and space.

Package Shape:

RECTANGULAR - The rectangular shape of the package ensures compatibility with standard PCB layouts, making integration seamless.

Maximum Transmit Delay:

12 ns - The low transmit delay ensures fast signal transmission, ideal for applications requiring real-time data processing.

Maximum Supply Voltage-1:

5.5 V - This voltage level provides a stable power supply, ensuring consistent performance of the device.

Power Supplies (V):

5 - With a standard power supply requirement of 5V, this product is compatible with many existing systems and designs.

No. of Terminals:

16 - The ample number of terminals allows for flexible connectivity options and enables versatile circuit configurations.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Minimum Supply Voltage-1:

4.5 V - The minimum supply voltage requirement of 4.5V ensures efficient operation even in lower power scenarios.

Maximum High Level Input Current:

0.000001 Amp - The low input current requirement reduces power consumption, making it energy-efficient.

Minimum Supply Voltage:

4.5 V - The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature:

85 °C - The high operating temperature range allows for reliable performance in various environmental conditions.

Output Characteristics:

3-STATE - The 3-state output feature provides flexibility in controlling the output signal, allowing for multiple configurations.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature enables operation in extreme cold conditions, making it suitable for harsh environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - The high-quality terminal finish ensures reliable connections and prevents corrosion, ensuring long-term performance.

Terminal Position:

DUAL - The dual terminal position allows for different mounting orientations, enhancing flexibility in installation.

Maximum Seated Height:

2 mm - The low seated height profile saves space on the PCB, making it a good choice for compact designs.

Width:

5.3 mm - The compact width of the device allows for dense PCB layouts, ideal for applications with space constraints.

Maximum Output Low Current:

6 Amp - With a high output current capacity, this product can drive demanding loads without overheating or failure.

Output Polarity:

TRUE - The true output polarity ensures accurate signal transmission, preventing signal distortion or errors.

Receiver No. of Bits:

2 - The 2-bit receiver allows for the transfer of binary data, suitable for applications requiring simple data communication.

Differential Output:

YES - The differential output feature improves noise immunity and signal integrity, making it ideal for high-noise environments.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum reflow time ensures proper soldering during installation, ensuring reliable connections.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature capability allows for lead-free soldering, meeting industry standards.

Length:

10.2 mm - The length of the device is compact, allowing for space-efficient PCB layouts and enabling compact device designs.

Minimum Out Swing:

2 V - The minimum output swing of 2V ensures reliable signal transmission, suitable for various communication protocols.

Temperature Grade:

INDUSTRIAL - The industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Maximum Receive Delay:

27 ns - The low receive delay ensures fast data reception, ideal for applications requiring real-time data processing.

Technology:

BICMOS - The BiCMOS technology combines the benefits of bipolar and CMOS, providing high-speed operation and low power consumption.

Terminal Form:

GULL WING - The gull-wing terminal form allows for easy soldering and robust connections, ensuring reliability in operation.

Interface Standard:

EIA-422-B; TIA-422-B; V.11 - The compatibility with multiple interface standards ensures interoperability with a wide range of systems and devices.

Maximum Supply Current:

9 mA - With a low supply current requirement, this product minimizes power consumption, making it energy-efficient.

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER - The differential Schmitt trigger input characteristic provides noise immunity, ensuring reliable signal reception.

Nominal Supply Voltage:

5 V - The nominal supply voltage of 5V ensures compatibility with standard power sources and existing circuits.

Terminal Pitch:

1.27 mm - The terminal pitch allows for easy connection to standard PCB layouts, simplifying installation and maintenance.

Nominal Supply Voltage-1:

5 V - The 5V nominal supply voltage provides a stable power source for consistent device operation.

Driver No. of Bits:

2 - The 2-bit driver configuration allows for the transfer of binary data, suitable for various communication applications.

Interface IC Type:

LINE TRANSCEIVER - The line transceiver interface IC type enables bidirectional communication between different devices, enhancing connectivity options.

Technical Specifications

Line Drivers & Receivers SN65C1167NSRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

RECEIVER 3-STATE OUTPUTS

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

6 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

27 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

7 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

5.3 mm

Trade Compliance

SN65C1167NSRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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