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SN65472DREP

Texas Instruments

SN65472DREP by Texas Instruments

SN65472DREP by Texas Instruments is a peripheral driver with 8 terminals, operating at 5V. It features a max output current of 0.5A and uses NAND gate technology. Ideal for industrial applications requiring reliable signal driving in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,600 parts In-Stock

1+ parts

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4,600

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Digiode

USA . 3,842 parts In-Stock

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3,842

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Vyrian

USA . 3,414 parts In-Stock

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3,414

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,660 parts In-Stock

1+ parts

$8.808

100+ parts

-

1k+ parts

$9.492

10k+ parts

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1,660

$8.808

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$9.492

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DigiPath Technology Company

USA . 2,377 parts In-Stock

1+ parts

$9.699

100+ parts

$8.923

1k+ parts

-

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2,377

$9.699

$8.923

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ChromeModa Solutions

Germany . 1,189 parts In-Stock

1+ parts

$9.897

100+ parts

$8.116

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1,189

$9.897

$8.116

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IDEA Electronic Components Group

UK . 908 parts In-Stock

1+ parts

$9.897

100+ parts

$9.402

1k+ parts

$8.907

10k+ parts

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908

$9.897

$9.402

$8.907

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One Stop Electronics

USA . 1,534 parts In-Stock

1+ parts

$14.500

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1,534

$14.500

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AZTECH Wire

Italy . 313 parts In-Stock

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$18.184

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313

$18.184

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QUARKTWIN TECHNOLOGY LTD

USA . 23,622 parts In-Stock

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23,622

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 483 parts In-Stock

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483

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Overview

Unlock the full potential of your devices with the SN65472DREP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The SN65472DREP falls under the category of Peripheral Drivers, offering seamless integration and enhanced performance for various applications. With its compact design and advanced technology, this product provides customers with unparalleled value, efficiency, and precision. Upgrade your systems with the SN65472DREP and experience the difference that Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the internal components of the peripheral driver.

Surface Mount: YES

Enables easy and secure mounting on printed circuit boards, saving space and simplifying assembly.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a wide range of electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring stable performance in demanding environments.

Nominal Supply Voltage: 5 V

Operates at a standard 5V supply voltage, making it easy to integrate into existing systems.

Technical Specifications

Peripheral Drivers SN65472DREP attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

SN65472DREP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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