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SN209002DBVR

Texas Instruments

SN209002DBVR by Texas Instruments

SN209002DBVR by Texas Instruments is a CMOS regulator with 5 terminals and a max output current of 0.15 A. It has an operating temperature range from -40 to 125°C, making it suitable for various applications requiring a fixed output voltage of 3 V. The package style is small outline, thin profile, and it offers a max voltage tolerance of 3.7%.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,631 parts In-Stock

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Vyrian

USA . 3,123 parts In-Stock

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3,123

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Semicontronic

India . 984 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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984

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 603 parts In-Stock

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$1.500

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603

$1.500

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Parana Technologies

USA . 321 parts In-Stock

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$5.412

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$502.595

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$4.871

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321

$5.412

$502.595

$4.871

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DigiPath Technology Company

USA . 1,645 parts In-Stock

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$5.959

100+ parts

$5.483

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1,645

$5.959

$5.483

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ChromeModa Solutions

Germany . 4,516 parts In-Stock

1+ parts

$6.081

100+ parts

$4.986

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4,516

$6.081

$4.986

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IDEA Electronic Components Group

UK . 890 parts In-Stock

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$6.081

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$5.473

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890

$6.081

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$5.473

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AZTECH Wire

Italy . 368 parts In-Stock

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$10.488

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368

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One Stop Electronics

USA . 1,118 parts In-Stock

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$15.500

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Corphita

USA . 554 parts In-Stock

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Corohmni

South Africa . 215 parts In-Stock

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Overview

Enhance your electronic projects with the SN209002DBVR from Texas Instruments, a leading manufacturer known for top-quality components. This versatile Other Function Regulator is perfect for a wide range of applications, offering reliable performance and precision. With its small outline and thin profile package style, this regulator is easy to integrate into your designs. Enjoy the benefits of fixed adjustability, dual terminal position, and a maximum output current of 0.15 A. Trust Texas Instruments to deliver the value and efficiency you need for your next project with the SN209002DBVR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and can withstand rough handling, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space, making the product suitable for compact electronic devices.

Operating Temperature (TJ-Max): 125 °C

High operating temperature allows the product to function effectively in various environments without overheating.

Technology: CMOS

CMOS technology offers lower power consumption and high noise immunity, making the product energy-efficient and reliable.

Package Shape: RECTANGULAR

Rectangular package shape is convenient for handling and space-saving, making the product suitable for compact designs.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections, ensuring stable performance of the product.

Operating Temperature (TJ-Min): -40 °C

Low operating temperature allows the product to perform efficiently even in cold environments without any issues.

Packing Method: TR

TR packing method ensures easy handling and storage of the product, making it convenient for manufacturers and distributors.

Maximum Voltage Tolerance: 3.7 %

High voltage tolerance ensures the stability and reliability of the product under varying input voltages, making it suitable for different applications.

Nominal Output Voltage-1: 3 V

Stable output voltage of 3V ensures consistent performance of the product, making it ideal for powering various electronic components.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting the product to other devices, making it versatile for different circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Small outline and thin profile package style saves space and allows for compact designs, making the product suitable for portable electronic devices.

Adjustability: FIXED

Fixed adjustability simplifies the user interface and ensures stable output voltage, making the product hassle-free for customers.

Terminal Pitch: 0.95 mm

Narrow terminal pitch allows for close placement of components, reducing the overall size of the product and enabling high-density PCB designs.

Maximum Line Regulation: 0.018 %

Low line regulation ensures minimal voltage fluctuations in the output, providing stable power supply to connected devices.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in connecting the product, ensuring secure connections and reliable performance.

Maximum Output Current-1: 0.15 A

High output current capability of 0.15A allows the product to power multiple components simultaneously, making it versatile for various applications.

Nominal Dropout Voltage-1: 1 V

Low dropout voltage of 1V ensures efficient power conversion and minimal power loss, making the product energy-efficient and cost-effective.

Maximum Input Voltage Absolute: 10 V

High absolute input voltage of 10V provides a wide operating range for the product, making it compatible with different power sources.

Technical Specifications

Other Function Regulators SN209002DBVR attributes and parameters. Explore more Other Function Regulators devices from Texas Instruments

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

1 V

Maximum Input Voltage Absolute:

JESD-30 Code:

R-PDSO-G5

Maximum Line Regulation:

.018 %

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Nominal Output Voltage-1:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Trade Compliance

SN209002DBVR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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