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SM72442MTX

Texas Instruments

SM72442MTX by Texas Instruments

SM72442MTX by Texas Instruments is a 28-terminal IC with Vsup range of 4.75-5.25V, operating b/w -40 to 105°C. It's a small outline analog circuit for industrial applications, featuring gull wing terminals and shrink pitch package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,119 parts In-Stock

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8,119

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Digiode

USA . 4,894 parts In-Stock

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4,894

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Anansix

USA . 150 parts In-Stock

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150

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Prism Electronics

USA . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,843 parts In-Stock

1+ parts

$2.126

100+ parts

$197.451

1k+ parts

$1.914

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1,843

$2.126

$197.451

$1.914

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DigiPath Technology Company

USA . 314 parts In-Stock

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$2.341

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314

$2.341

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ChromeModa Solutions

Germany . 2,113 parts In-Stock

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$2.389

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$1.959

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2,113

$2.389

$1.959

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IDEA Electronic Components Group

UK . 886 parts In-Stock

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$2.389

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$2.150

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886

$2.389

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$2.150

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One Stop Electronics

USA . 1,356 parts In-Stock

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$3.500

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$3.500

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AZTECH Wire

Italy . 773 parts In-Stock

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$5.255

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773

$5.255

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Corphita

USA . 3,670 parts In-Stock

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3,670

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Perfect Parts

USA . 16 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the SM72442MTX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This versatile product falls under the category of Other Function Semiconductors, making it suitable for a wide range of applications. From industrial to consumer electronics, this small outline, shrink pitch package offers exceptional value and benefits to customers. Experience superior performance and efficiency with the SM72442MTX, the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product suitable for a wide range of industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage ensures compatibility with most electronic systems and components.

No. of Terminals: 28

Having 28 terminals provides a high level of connectivity and flexibility for various input and output options in circuit design.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this product can withstand high temperature environments, ensuring stability and reliability in industrial settings.

Width (mm): 4.4 mm

Compact width of 4.4mm saves space on the circuit board, allowing for efficient use of available PCB real estate.

Other IC type: ANALOG CIRCUIT

Analog circuit capabilities make this product suitable for applications requiring precise signal processing and control, offering higher performance in analog electronics.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65mm, this product enables high-density mounting, enhancing circuit design flexibility and compactness.

Technical Specifications

Other Function Semiconductors SM72442MTX attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

SM72442MTX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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