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SM470R1B1MHKPS

Texas Instruments

SM470R1B1MHKPS by Texas Instruments

Texas Instruments SM470R1B1MHKPS microcontroller features 32-bit architecture, 1048576 ROM words, and 65536 RAM bytes. Ideal for military-grade applications with MIL-STD temperature range support. Offers 12 ADC channels, 16 DMA channels, and various connectivity options like CAN, I2C, SCI, and SPI.

Median Price

$639.115

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$639.115

100+ parts

-

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10

$639.115

-

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Digiode

USA . 4,494 parts In-Stock

1+ parts

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4,494

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Vyrian

USA . 2,161 parts In-Stock

1+ parts

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2,161

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NexGen Digital

USA . 1,255 parts In-Stock

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1,255

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Distributors (Availability)

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Ampacity Inc.

Singapore . 578 parts In-Stock

1+ parts

$5.000

100+ parts

-

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578

$5.000

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One Stop Electronics

USA . 1,303 parts In-Stock

1+ parts

$6.000

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1,303

$6.000

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AZTECH Wire

Italy . 513 parts In-Stock

1+ parts

$16.533

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513

$16.533

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$25.804

100+ parts

$23.482

1k+ parts

$21.159

10k+ parts

-

870

$25.804

$23.482

$21.159

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Parana Technologies

USA . 913 parts In-Stock

1+ parts

$43.650

100+ parts

$4,053.569

1k+ parts

$39.285

10k+ parts

-

913

$43.650

$4,053.569

$39.285

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DigiPath Technology Company

USA . 750 parts In-Stock

1+ parts

$48.064

100+ parts

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750

$48.064

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ChromeModa Solutions

Germany . 2,489 parts In-Stock

1+ parts

$49.045

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$40.217

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2,489

$49.045

$40.217

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IDEA Electronic Components Group

UK . 1,919 parts In-Stock

1+ parts

$49.045

100+ parts

$46.593

1k+ parts

$44.140

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1,919

$49.045

$46.593

$44.140

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Argo Parts USA

USA . 3,868 parts In-Stock

1+ parts

$639.115

100+ parts

$632.724

1k+ parts

$626.333

10k+ parts

$619.942

3,868

$639.115

$632.724

$626.333

$619.942

Continental Prestige Electronics

USA . 3,309 parts In-Stock

1+ parts

$639.115

100+ parts

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$626.333

3,309

$639.115

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$626.333

Corphita

USA . 1,539 parts In-Stock

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1,539

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Microchip USA

USA . 1,476 parts In-Stock

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1,476

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$626.333

1k+ parts

$607.160

10k+ parts

$594.377

500

-

$626.333

$607.160

$594.377

Perfect Parts

USA . 26 parts In-Stock

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26

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Overview

Unlock the power of cutting-edge technology with the SM470R1B1MHKPS microcontroller by Texas Instruments. Designed with precision and reliability in mind, this innovative product offers a wide range of applications in various industries. With advanced features such as low power mode and a wide range of connectivity options, this microcontroller provides unmatched value and performance for your projects. Experience seamless operation and maximum efficiency with the Texas Instruments SM470R1B1MHKPS microcontroller.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures durability and reliability, making this product suitable for rugged environments.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and making the product ideal for mass production.

Maximum Supply Voltage: 2.05 V

With a maximum supply voltage of 2.05V, this microcontroller is suitable for low power applications, helping to optimize energy consumption.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance, making this microcontroller suitable for complex tasks and applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures efficient data processing and execution, making this microcontroller a reliable choice for high-speed operations.

Maximum Clock Frequency: 10 MHz

The maximum clock frequency of 10MHz allows for fast data processing and response times, making this microcontroller suitable for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for various applications.

Connectivity: CAN(2), I2C(5), SCI(3), SPI(2)

The multiple connectivity options including CAN, I2C, SPI, and SCI make this microcontroller versatile and compatible with a wide range of communication protocols.

Technical Specifications

Microcontrollers SM470R1B1MHKPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES MINIMUM 1.71 V AT 48 MHZ

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-CQFP-G84

Length:

13.81 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

8

No. of Serial I/Os:

12

No. of Terminals:

84

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

220 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

HQFP84,.76SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

2.8 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.81 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

13.81 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(5), SCI(3), SPI(2)

Peripherals:

DMA(16), TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

SM470R1B1MHKPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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