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SD3GDAIII/NOPB

Texas Instruments

SD3GDAIII/NOPB by Texas Instruments

SD3GDAIII/NOPB by Texas Instruments is an Interface cable equalizer board (LMH0307, LMH0376, LMH0395) with a Graphical User Interface. It falls under Development Boards category and comes in a Box package. Ideal for Evaluation and Demonstration purposes.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,482 parts In-Stock

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Digiode

USA . 594 parts In-Stock

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One Stop Electronics

USA . 195 parts In-Stock

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$2.100

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195

$2.100

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AZTECH Wire

Italy . 258 parts In-Stock

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$17.766

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Ampacity Inc.

Singapore . 148 parts In-Stock

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$64.100

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$64.100

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Semicontronic

India . 1,142 parts In-Stock

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$83.100

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$81.022

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$80.607

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1,142

$83.100

$81.022

$80.607

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ChromeModa Solutions

Germany . 5,883 parts In-Stock

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Corphita

USA . 2,644 parts In-Stock

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DigiPath Technology Company

USA . 2,074 parts In-Stock

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Parana Technologies

USA . 1,643 parts In-Stock

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$1.272

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IDEA Electronic Components Group

UK . 1,419 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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Perfect Parts

USA . 3 parts In-Stock

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Overview

Enhance your development projects with the SD3GDAIII/NOPB by Texas Instruments. This high-quality interface cable equalizer offers unrivaled performance and reliability, thanks to the renowned manufacturer's expertise. Ideal for evaluation boards and kits, this product provides a seamless user experience with its graphical interface. Take your designs to the next level with the value and benefits that the SD3GDAIII/NOPB brings to the table.

Feature Benefit Bullets

Other Names: 296-36877 / SD3GDAIII/NOPB-ND

Easy to identify and locate the product with multiple names.

Category: Development Boards, Kits, Programmers / Evaluation Boards

Versatile usage in development and evaluation scenarios.

Package: Box

Secure packaging for safe transportation and storage.

Type: Interface

Facilitates connection and communication between devices.

Function: Cable Equalizer

Improves signal quality over long cable lengths.

Utilized IC / Part: LMH0307, LMH0376, LMH0395

High-quality components for reliable performance.

Supplied Contents: Board(s)

Ready-to-use board for quick setup and implementation.

Secondary Attributes: Graphical User Interface (GUI)

User-friendly interface for easy configuration and control.

Base Product Number: SD3

Part of a recognized product line with proven track record.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Minimal risk of moisture damage, ensuring product longevity.

Technical Specifications

Additional Parts SD3GDAIII/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-36877
SD3GDAIII/NOPB-ND

Function:

Cable Equalizer

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Secondary Attributes:

Graphical User Interface (GUI)

Utilized IC / Part:

LMH0307, LMH0376, LMH0395

Package:

Box

Standard Package:

1

Base Product Number:

SD3

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

SD3GDAIII/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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