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SD387EVK/NOPB

Texas Instruments

SD387EVK/NOPB by Texas Instruments

SD387EVK/NOPB by Texas Instruments is an Interface Development Board for LMH0387. It supports 3Gbps HD/SD SDI with Cable Equalizer function. The kit includes board(s) and cable(s), ideal for evaluating and demonstrating video signal processing applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,793 parts In-Stock

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Digiode

USA . 3,270 parts In-Stock

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AZTECH Wire

Italy . 743 parts In-Stock

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$13.076

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Ampacity Inc.

Singapore . 1,283 parts In-Stock

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Semicontronic

India . 1,062 parts In-Stock

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$145.372

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$144.627

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One Stop Electronics

USA . 216 parts In-Stock

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$199.100

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ChromeModa Solutions

Germany . 6,180 parts In-Stock

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Corphita

USA . 3,819 parts In-Stock

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DigiPath Technology Company

USA . 1,030 parts In-Stock

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Parana Technologies

USA . 835 parts In-Stock

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IDEA Electronic Components Group

UK . 377 parts In-Stock

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Corohmni

South Africa . 99 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the SD387EVK/NOPB evaluation kit. This versatile interface cable equalizer is perfect for a wide range of applications, offering 3Gbps HD/SD SDI support and supplied with everything you need for easy installation. Experience the value and benefits of this development board, from its seamless functionality to its exceptional performance. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Other Names: 296-45834, SD387EVK/NOPB-ND

These names make it easy to identify and order the product.

Category: Development Boards, Kits, Programmers, Evaluation Boards

This product falls under categories that are essential for developing and evaluating electronic circuits and systems.

Package: Box

The packaging in a box ensures the safe transportation and storage of the product.

Type: Interface

It provides an interface for connecting different components or devices, making it versatile in various applications.

Function: Cable Equalizer

The cable equalizer function helps in optimizing signal quality over long cable runs, ensuring reliable data transmission.

Utilized IC / Part: LMH0387

The LMH0387 is a high-performance integrated circuit that enhances the functionality and performance of this product.

Primary Attributes: 3Gbps HD/SD SDI

Supporting 3Gbps HD/SD SDI signals makes this product suitable for high-definition video and data applications.

Supplied Contents: Board(s), Cable(s)

It comes with the necessary boards and cables for immediate use, saving time and effort in sourcing additional components.

Base Product Number: SD38

The base product number provides a standardized reference for this product within the product line.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With a low moisture sensitivity level, this product can withstand varying environmental conditions without damage.

Technical Specifications

Additional Parts SD387EVK/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-45834
SD387EVK/NOPB-ND

Function:

Cable Equalizer

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s), Cable(s)

Utilized IC / Part:

LMH0387

Package:

Box

Primary Attributes:

3Gbps HD/SD SDI

Standard Package:

1

Base Product Number:

SD38

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

SD387EVK/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A991

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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