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S4MF06607BSPZQQ1

Texas Instruments

S4MF06607BSPZQQ1 by Texas Instruments

Texas Instruments S4MF06607BSPZQQ1 is a 32-bit microcontroller with Cortex-M3 CPU, 524288 ROM words, and 64 RAM words. Ideal for automotive applications, it features 16-Ch 10-Bit ADC channels, CAN(2), SPI(2), UART connectivity, and low power mode support. Operating temperature ranges from -40 to 125°C with a max clock frequency of 20 MHz.

Median Price

$8.061

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 86 parts In-Stock

1+ parts

$5.871

100+ parts

$5.410

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86

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Verical

USA . 86 parts In-Stock

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$5.871

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$5.410

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-

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86

$5.871

$5.410

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Rochester

USA . 16 parts In-Stock

1+ parts

$7.870

100+ parts

$7.710

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$7.560

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16

$7.870

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$7.560

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Texas Instruments

USA . 467 parts In-Stock

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$11.197

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$9.780

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$6.745

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467

$11.197

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$6.745

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Mouser Electronics

USA . 576 parts In-Stock

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$18.970

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$12.710

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$12.490

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576

$18.970

$12.710

$12.490

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DigiKey

USA . 270 parts In-Stock

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$18.970

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$13.126

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$12.216

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$18.970

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$12.216

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Chip1Stop

Japan . 180 parts In-Stock

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$8.061

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$8.061

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Distributors (In-Stock)

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Digiode

USA . 4,523 parts In-Stock

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$7.340

100+ parts

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$7.340

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Chip Stock

USA . 9,368 parts In-Stock

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Vyrian

USA . 5,901 parts In-Stock

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Nova Conductors

Japan . 72 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 141 parts In-Stock

1+ parts

$6.570

100+ parts

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141

$6.570

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Corphita

USA . 339 parts In-Stock

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$6.953

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339

$6.953

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Semicontronic

India . 164 parts In-Stock

1+ parts

$10.860

100+ parts

$10.588

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$10.534

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164

$10.860

$10.588

$10.534

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Microchip USA

USA . 1,906 parts In-Stock

1+ parts

$47.210

100+ parts

$46.530

1k+ parts

$46.200

10k+ parts

$45.860

1,906

$47.210

$46.530

$46.200

$45.860

Parana Technologies

USA . 993 parts In-Stock

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$60.202

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993

$60.202

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DigiPath Technology Company

USA . 1,568 parts In-Stock

1+ parts

$66.290

100+ parts

$60.987

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1,568

$66.290

$60.987

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Aztec Data Supply Inc.

USA . 2,147 parts In-Stock

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$66.750

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$66.750

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ChromeModa Solutions

Germany . 5,471 parts In-Stock

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$67.643

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$55.467

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5,471

$67.643

$55.467

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IDEA Electronic Components Group

UK . 665 parts In-Stock

1+ parts

$67.643

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$64.261

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$60.879

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665

$67.643

$64.261

$60.879

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A-Z Elektronik GmbH

Germany . 5,519 parts In-Stock

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Bastille Electronics

Australia . 4,894 parts In-Stock

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Argo Parts USA

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,765 parts In-Stock

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Formix International (Excess)

India . 1,284 parts In-Stock

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Kepictronics

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900

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Perfect Parts

USA . 325 parts In-Stock

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325

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Overview

Unlock the potential of your automotive applications with the S4MF06607BSPZQQ1 microcontroller from Texas Instruments. Designed with cutting-edge technology, this high-quality device offers superior performance and reliability. With a wide range of peripherals including CRC, DWD, and TIMER, this microcontroller provides unmatched versatility for your projects. Trust in Texas Instruments' renowned reputation for excellence and innovation, and elevate your designs to new heights with the S4MF06607BSPZQQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and cost during production.

Maximum Supply Voltage: 1.32 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, increasing the efficiency of the product.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width allows for faster data processing and multitasking capabilities.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making the product suitable for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on PCBs, maximizing component density and reducing overall size.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex algorithms and calculations efficiently, making it suitable for advanced applications.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages allows for flexibility in design and compatibility with different power sources.

No. of Terminals: 100

A higher number of terminals provide more I/O options and connectivity possibilities, enhancing the versatility of the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package styles offer space-saving and high-density packaging options, ideal for compact electronic devices.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures operational stability even in low-power conditions, improving reliability and performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and extended operation without overheating.

CPU Family: CORTEX-M3

The Cortex-M3 architecture provides high performance and energy efficiency, making the microcontroller suitable for a wide range of applications.

No. of External Interrupts: 4

Multiple external interrupts allow for efficient handling of real-time events and responsive system operation.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the microcontroller to function in extreme cold environments, ensuring reliable performance in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provide corrosion resistance and excellent conductivity, ensuring reliable connections and long-term performance.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its functionality in data acquisition and processing.

Terminal Position: QUAD

Quad terminal position offers secure mounting and connection options, enhancing the durability and reliability of the product.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data and code, enabling advanced functionality and feature-rich applications.

Maximum Seated Height: 1.6 mm

Low maximum seated height facilitates compact designs and slim form factors, making the product suitable for space-constrained applications.

RAM Words: 64

Having a sufficient RAM capacity enables efficient data storage and processing, ensuring smooth operation and multitasking capabilities.

Width: 14 mm

The compact width of the microcontroller makes it suitable for applications where space-saving and size constraints are important factors.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging, ensuring high product quality and reliability during the manufacturing process.

Peripherals: CRC, DWD, TIMER

Integrated peripherals such as CRC, DWD, and TIMER enhance the functionality and performance of the microcontroller, enabling diverse application possibilities.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency enables fast data processing and real-time operation, making the microcontroller suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow process time at peak temperature ensures reliable soldering and assembly, reducing manufacturing time and costs.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering and assembly of the microcontroller onto PCBs, ensuring robust connections.

Length: 14 mm

Compact length of the microcontroller contributes to space-saving designs and efficient board layouts, ideal for compact electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the microcontroller can withstand extreme temperature fluctuations and harsh conditions, making it suitable for automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance and energy efficiency, making it ideal for embedded systems and IoT applications.

RAM Bytes: 65536

Large RAM capacity in bytes provides ample data storage and processing capabilities, enabling efficient operation and multitasking.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the microcontroller suitable for energy-efficient and high-performance applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical attachment to PCBs, ensuring stable connections and reliability in operation.

Analog To Digital Convertors: 16-Ch 10-Bit

Integrated analog-to-digital converters with 16 channels and 10-bit resolution enable precise and accurate conversion of analog signals, expanding the application possibilities of the microcontroller.

Maximum Supply Current: 110 mA

The low maximum supply current helps in reducing power consumption and heat dissipation, improving energy efficiency and extending battery life in portable devices.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures reliable operation and consistent performance of the microcontroller across various operating conditions.

No. of Serial I/Os: 4

Multiple serial I/Os provide versatile connectivity options for interfacing with external devices, expanding the communication capabilities of the microcontroller.

Connectivity: CAN(2), SPI(2), UART

Support for multiple communication interfaces such as CAN, SPI, and UART enables seamless connectivity with a wide range of external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible programming of the microcontroller, enabling quick updates and modifications to the firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm provides high-density mounting options, allowing for compact designs and efficient use of PCB space.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and algorithms, enhancing computational efficiency and precision in numerical calculations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller's resistance to moisture sensitivity during soldering and assembly processes, ensuring reliable performance in humid conditions.

Speed: 80 rpm

Operational speed of 80 rpm enables fast data processing and real-time response, making the microcontroller suitable for high-performance applications.

Low Power Mode: YES

Low-power mode functionality helps in reducing energy consumption during idle or standby modes, prolonging battery life and enhancing overall power efficiency.

On Chip Program ROM Width: 8

Having on-chip program ROM width of 8 bits enables efficient storage and execution of program instructions, enhancing the microcontroller's performance capabilities.

No. of I/O Lines: 49

A high number of I/O lines provide versatile connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's flexibility in system integration.

Technical Specifications

Microcontrollers S4MF06607BSPZQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

4

No. of I/O Lines:

49

No. of Serial I/Os:

4

No. of Terminals:

100

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

64

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), SPI(2), UART"

Peripherals:

"CRC, DWD, TIMER"

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

S4MF06607BSPZQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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