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PTPSM365R6FRDN

Texas Instruments

PTPSM365R6FRDN by Texas Instruments

PTPSM365R6FRDN by Texas Instruments is a switching regulator with 11 terminals, operating b/w -40 to 125°C. It offers a max output voltage of 13V and current of 0.6A, suitable for applications requiring pulse width modulation control at frequencies up to 2300 kHz. Ideal for compact designs needing efficient power management in various electronic systems.

Median Price

$2.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$2.600

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650

$2.600

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Vyrian

USA . 5,564 parts In-Stock

1+ parts

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5,564

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Digiode

USA . 4,863 parts In-Stock

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4,863

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 299 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

299

$1.500

$1.462

$1.455

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Corohmni

South Africa . 579 parts In-Stock

1+ parts

$2.186

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579

$2.186

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Continental Prestige Electronics

USA . 6,234 parts In-Stock

1+ parts

$2.600

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$2.548

6,234

$2.600

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$2.548

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.600

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1,000

$2.600

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Argo Parts USA

USA . 692 parts In-Stock

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$2.600

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692

$2.600

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$2.652

100+ parts

$2.652

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$2.652

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150

$2.652

$2.652

$2.652

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Ampacity Inc.

Singapore . 1,587 parts In-Stock

1+ parts

$4.500

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1,587

$4.500

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One Stop Electronics

USA . 1,119 parts In-Stock

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$7.500

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1,119

$7.500

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AZTECH Wire

Italy . 748 parts In-Stock

1+ parts

$19.125

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748

$19.125

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Corphita

USA . 2,170 parts In-Stock

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2,170

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Overview

Discover the power and efficiency of the PTPSM365R6FRDN by Texas Instruments, a cutting-edge switching regulator perfect for a wide range of applications. Manufactured with top-notch quality by Texas Instruments, this product offers unparalleled value with its advanced features and reliable performance. Whether you're in need of a compact and versatile solution for your electronics project or looking to optimize power management in your system, the PTPSM365R6FRDN is the perfect choice. Upgrade your devices and experience superior functionality with this high-quality switching regulator today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape makes it compatible with standard mounting systems.

No. of Terminals: 11

Provides flexibility for connecting various components and peripherals.

Maximum Output Current: 0.6 A

Capable of delivering up to 0.6 Amps of output current, suitable for many applications.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique ensures efficient power conversion and regulation.

Maximum Operating Temperature: 125 °C

Operating temperature up to 125°C allows for reliable performance in various environments.

Nominal Input Voltage: 24 V

Supports a nominal input voltage of 24V, making it compatible with standard power sources.

Maximum Switching Frequency: 2300 kHz

High switching frequency of 2300 kHz enables fast response and regulation.

Technical Specifications

Switching Regulators & Controllers PTPSM365R6FRDN attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

65 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

24 V

JESD-30 Code:

R-PQCC-N11

Length:

4.5 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

11

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.6 A

Maximum Output Voltage:

13 V

Minimum Output Voltage:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC11,.18X.14(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

2.1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2300 kHz

Technology:

HYBRID

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Width (mm):

3.5 mm

Trade Compliance

PTPSM365R6FRDN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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