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PTCAL9539RTWRQ1

Texas Instruments

PTCAL9539RTWRQ1 by Texas Instruments

PTCAL9539RTWRQ1 by Texas Instruments is a Parallel I/O Port IC with 16 bits, operating at up to 1 MHz clock frequency. It has a supply voltage range of 1.08V to 3.6V and can withstand temperatures from -40°C to 125°C. This chip carrier package is suitable for various general-purpose parallel I/O applications in automotive electronics due to its AEC-Q100 screening level certification.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.770

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500

$0.770

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Vyrian

USA . 5,156 parts In-Stock

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5,156

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Digiode

USA . 3,961 parts In-Stock

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3,961

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.755

100+ parts

-

1k+ parts

$0.724

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500

$0.755

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$0.724

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Ampacity Inc.

Singapore . 816 parts In-Stock

1+ parts

$14.000

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816

$14.000

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AZTECH Wire

Italy . 207 parts In-Stock

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$19.705

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207

$19.705

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One Stop Electronics

USA . 843 parts In-Stock

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$26.000

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843

$26.000

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Corphita

USA . 144 parts In-Stock

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Overview

Enhance your electronic designs with the PTCAL9539RTWRQ1 from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for Parallel I/O Ports. This versatile component offers 16 I/O lines, a wide operating temperature range, and a compact form factor that is ideal for various applications. Unlock the potential of your projects with this high-performance IC, providing unmatched value and flexibility to meet your design needs. Elevate your designs with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and heat resistance, ensuring the product will have a long lifespan.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources.

No. of Bits: 16

With 16 bits, this product can handle a large amount of data simultaneously, increasing efficiency and speed.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offered provides flexibility in installation options, catering to different design requirements.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for this product to be used in various environments, even in extreme conditions.

No. of Ports: 16

Having 16 ports enables the device to connect to multiple external devices simultaneously, enhancing its versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy efficient and reliable.

No. of I/O Lines: 16

With 16 input/output lines, this product can handle a large volume of data transfer, providing quick and efficient communication.

Technical Specifications

Parallel I/O Ports PTCAL9539RTWRQ1 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

1 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.08 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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