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PT4563N

Texas Instruments

PT4563N by Texas Instruments

PT4563N by Texas Instruments is a DC-DC regulated power supply module with a nominal output voltage of 12V and max output current of 2.5A. It operates in industrial temperature grade range (-40 to 85°C) and has a max total power output of 30W, making it suitable for various power supply applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,826 parts In-Stock

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Vyrian

USA . 4,320 parts In-Stock

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DF Sales Co.

USA . 1 parts In-Stock

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DF Sales Co.

USA . 1 parts In-Stock

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One Stop Electronics

USA . 1,035 parts In-Stock

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$5.500

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$5.500

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AZTECH Wire

Italy . 521 parts In-Stock

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$14.594

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521

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Parana Technologies

USA . 1,261 parts In-Stock

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$17.568

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$17.766

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$17.568

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$17.766

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DigiPath Technology Company

USA . 1,370 parts In-Stock

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$19.344

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$19.344

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ChromeModa Solutions

Germany . 1,119 parts In-Stock

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$19.739

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$16.186

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IDEA Electronic Components Group

UK . 705 parts In-Stock

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$19.739

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$18.752

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$17.765

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705

$19.739

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$17.765

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Corphita

USA . 2,973 parts In-Stock

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Overview

Experience the ultimate power solution with the PT4563N by Texas Instruments. Crafted with precision and excellence, this DC-DC regulated power supply module offers unparalleled reliability and performance. Ideal for industrial applications, this power supply module features a trim or adjustable output, ensuring optimal voltage control. With a maximum output current of 2.5 A and a total power output of 30 W, the PT4563N delivers unmatched efficiency and power. Trust Texas Instruments to provide you with cutting-edge technology that meets all your power supply needs. Elevate your projects with the PT4563N today.

Feature Benefit Bullets

Package Body Material: METAL

Metal body provides durability and ensures good heat dissipation, making the product reliable for long-term use.

Trim or Adjustable Output (V): YES

Adjustable output allows for customization and versatility in various applications, providing flexibility to the user.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and installation in different systems or devices.

No. of Terminals: 19

Having a higher number of terminals allows for connecting multiple components or devices, increasing the product's functionality.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly enhances the product's precision and performance, making it suitable for demanding applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can withstand harsh environmental conditions and operate reliably in various scenarios.

Minimum Output Voltage: 10.8 V

Having a minimum output voltage of 10.8 V ensures compatibility with a wide range of devices and applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function effectively in cold environments or during startup in challenging conditions.

Maximum Output Voltage: 13.2 V

High maximum output voltage provides sufficient power for demanding applications, ensuring reliable performance under heavy loads.

Terminal Position: SINGLE

Single terminal position simplifies installation and reduces the risk of wiring errors, enhancing the product's ease of use.

Maximum Load Regulation: 1 %

Precise load regulation ensures stable output voltage regardless of the load conditions, making the product suitable for sensitive electronics.

Other IC type: DC-DC REGULATED POWER SUPPLY MODULE

DC-DC regulated power supply module ensures efficient power conversion and consistent output voltage, improving overall system reliability.

Nominal Input Voltage: 48 V

Nominal input voltage of 48 V is compatible with a wide range of power sources, offering flexibility in system integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can withstand tough operating conditions in industrial environments.

Maximum Output Current: 2.5 A

High maximum output current capability provides sufficient power for various applications, supporting devices with higher power requirements.

Technology: HYBRID

Hybrid technology combines the advantages of different power supply techniques, offering improved efficiency and performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form facilitates easy PCB mounting and soldering, ensuring reliable connections and secure installation.

Maximum Total Power Output: 30 W

High maximum total power output of 30 W supports power-hungry devices and applications, providing ample power reserves for peak loads.

Minimum Input Voltage: 36 V

Having a minimum input voltage of 36 V allows the product to operate effectively with lower power sources, expanding its usability.

Nominal Output Voltage: 12 V

Nominal output voltage of 12 V is commonly used in electronics, making the product compatible with a wide range of devices and circuits.

Maximum Input Voltage: 75 V

High maximum input voltage ensures compatibility with various power sources and protection against voltage surges or fluctuations.

Technical Specifications

Power Supply Modules PT4563N attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Maximum Input Voltage:

75 V

Minimum Input Voltage:

36 V

Nominal Input Voltage:

48 V

JESD-30 Code:

R-MSMA-T19

Maximum Load Regulation:

1 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

19

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.5 A

Maximum Output Voltage:

13.2 V

Minimum Output Voltage:

10.8 V

Nominal Output Voltage:

12 V

Package Body Material:

METAL

Package Equivalence Code:

SIP19/27

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Total Power Output:

30 W

Trim or Adjustable Output (V):

YES

Trade Compliance

PT4563N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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