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PSN74HCT595PWR

Texas Instruments

PSN74HCT595PWR by Texas Instruments

PSN74HCT595PWR by Texas Instruments is an 8-bit digital shift register with a supply voltage of 5V, operating temperature range of -40 to 125°C, and max frequency of 25MHz. It features a small outline package style suitable for surface mount applications. This CMOS technology device has a propagation delay of 53ns and output polarity is true, making it ideal for high-speed data transfer in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,354 parts In-Stock

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Digiode

USA . 322 parts In-Stock

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322

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One Stop Electronics

USA . 1,445 parts In-Stock

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$10.000

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1,445

$10.000

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AZTECH Wire

Italy . 816 parts In-Stock

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$12.717

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Parana Technologies

USA . 660 parts In-Stock

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$17.114

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$17.327

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660

$17.114

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$17.327

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DigiPath Technology Company

USA . 578 parts In-Stock

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$18.844

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$17.337

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578

$18.844

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ChromeModa Solutions

Germany . 4,362 parts In-Stock

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$19.229

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$15.768

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$19.229

$15.768

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IDEA Electronic Components Group

UK . 1,877 parts In-Stock

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$19.229

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$18.268

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$17.306

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Corphita

USA . 3,087 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments PSN74HCT595PWR digital shift register. Crafted with precision and superior quality, this product offers unmatched reliability and performance in a wide range of applications. Whether you're looking to streamline your circuit design or enhance your project's efficiency, this innovative component is designed to meet your needs. Experience seamless integration, advanced technology, and exceptional value with the Texas Instruments PSN74HCT595PWR - the ultimate solution for all your digital shift register requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the shift register.

No. of Bits: 8

Having 8 bits allows for a wide range of data storage and processing capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with most electronic systems.

Propagation Delay (tpd): 53 ns

A low propagation delay ensures fast data transfer within the shift register.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the shift register efficient and reliable.

Technical Specifications

Digital Shift Registers PSN74HCT595PWR attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

Family:

HCT

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

25000000 Hz

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR, 13 INCH

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay (tpd):

53 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

PSN74HCT595PWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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