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PCM2706PJTRG4

Texas Instruments

PCM2706PJTRG4 by Texas Instruments

PCM2706PJTRG4 by Texas Instruments is a 16-bit D/A converter with a max analog output voltage of 1.98V. It is used in applications requiring digital-to-analog conversion, such as audio systems and multimedia devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,131 parts In-Stock

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Vyrian

USA . 2,363 parts In-Stock

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2,363

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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One Stop Electronics

USA . 649 parts In-Stock

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$2.000

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649

$2.000

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Corohmni

South Africa . 987 parts In-Stock

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$9.798

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987

$9.798

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Parana Technologies

USA . 2,318 parts In-Stock

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$14.326

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$14.777

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$14.777

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DigiPath Technology Company

USA . 1,895 parts In-Stock

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$15.775

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$15.775

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ChromeModa Solutions

Germany . 6,187 parts In-Stock

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$16.097

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$13.200

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$16.097

$13.200

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IDEA Electronic Components Group

UK . 2,282 parts In-Stock

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$16.097

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$15.292

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$14.487

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$16.097

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$14.487

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AZTECH Wire

Italy . 500 parts In-Stock

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$18.738

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$18.738

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Ampacity Inc.

Singapore . 1,463 parts In-Stock

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$23.000

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Continental Prestige Electronics

USA . 4,815 parts In-Stock

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Argo Parts USA

USA . 3,407 parts In-Stock

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Corphita

USA . 134 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the PCM2706PJTRG4 by Texas Instruments, a high-quality Digital-to-Analog Converter that offers exceptional value and benefits to customers. With its advanced technology and renowned manufacturer, this converter guarantees superior performance and reliability. Perfect for various applications, this product delivers impressive analog output voltage and supports multiple power supplies. Its compact design and surface mount capability make it easy to integrate into any system. Experience the advantages of the PCM2706PJTRG4 and unlock the potential for enhanced audio quality and functionality.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.98 V

Provides a high maximum analog output voltage, allowing for a wide range of output signals to be generated.

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and lightweight, protecting the internal components of the converter and making it easy to handle and transport.

Surface Mount: YES

Being surface mountable makes it compatible with modern PCB assembly processes, saving space and enabling easier mass production.

No. of Bits: 16

16 bits of resolution provide precise and accurate analog output signals.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages allows for flexibility in different system configurations.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style saves space on the PCB and allows for a compact design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the converter can function reliably in a wide range of environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures the converter can operate even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Width: 7 mm

The compact width of 7mm allows for space-efficient placement on the PCB.

Technical Specifications

Digital-to-Analog Converters PCM2706PJTRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement Binary

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

1.65 V

Maximum Analog Output Voltage:

1.98 V

Power Supplies:

3.3,5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

32

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.031 in (0.8 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Thin Profile

Package Code:

Package Equivalence Code:

TQFP32,.35SQ,32

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Trade Compliance

PCM2706PJTRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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