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PCM1791ADBG4

Texas Instruments

PCM1791ADBG4 by Texas Instruments

PCM1791ADBG4 by Texas Instruments is a 24-bit D/A converter with max analog output voltage of 3.2V, operating b/w -25 to 85°C. It features serial input format, dual terminal position, and requires nominal voltage of 5V. Ideal for applications requiring precise digital-to-analog conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,991 parts In-Stock

1+ parts

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6,991

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Digiode

USA . 3,441 parts In-Stock

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3,441

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,751 parts In-Stock

1+ parts

$6.725

100+ parts

-

1k+ parts

$7.407

10k+ parts

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1,751

$6.725

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$7.407

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ChromeModa Solutions

Germany . 2,605 parts In-Stock

1+ parts

$7.556

100+ parts

$6.196

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-

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2,605

$7.556

$6.196

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IDEA Electronic Components Group

UK . 1,660 parts In-Stock

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$7.556

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$6.800

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1,660

$7.556

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$6.800

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AZTECH Wire

Italy . 762 parts In-Stock

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$9.507

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762

$9.507

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One Stop Electronics

USA . 241 parts In-Stock

1+ parts

$14.000

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241

$14.000

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Ampacity Inc.

Singapore . 502 parts In-Stock

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$19.000

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502

$19.000

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Microchip USA

USA . 2,290 parts In-Stock

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2,290

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Corphita

USA . 2,207 parts In-Stock

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Continental Prestige Electronics

USA . 1,888 parts In-Stock

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1,888

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Argo Parts USA

USA . 1,566 parts In-Stock

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1,566

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DigiPath Technology Company

USA . 1,057 parts In-Stock

1+ parts

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$6.812

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1,057

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$6.812

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience unparalleled audio quality with the PCM1791ADBG4 by Texas Instruments, a leading manufacturer in the industry. This Digital-to-Analog Converter offers a maximum analog output voltage of 3.2 V, making it perfect for a wide range of applications. Whether you're a music enthusiast or an audio professional, this product delivers exceptional value and benefits. Enhance your listening experience with the PCM1791ADBG4 and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Maximum Analog Output Voltage: 3.2 V

High maximum analog output voltage allows for greater flexibility in signal processing and improved output resolution.

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good protection for internal components and ensures durability.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs and saves space.

No. of Bits: 24

Higher number of bits allows for finer resolution and accuracy in converting digital signals to analog.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages offers flexibility in different operating environments.

No. of Terminals: 28

Higher number of terminals provide more connectivity options and allow for versatile integration.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Nominal Supply Voltage: 5 V

Stable and standard supply voltage ensures consistent performance.

Technical Specifications

Digital-to-Analog Converters PCM1791ADBG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement Binary

Maximum Supply Current:

16 mA

No. of Bits:

24

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

3.2 V

Power Supplies:

3.3,5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP28,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

PCM1791ADBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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