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PAMC1304M25DW

Texas Instruments

PAMC1304M25DW by Texas Instruments

PAMC1304M25DW by Texas Instruments is a 16-terminal analog circuit IC with a nominal voltage of 3.3V, suitable for automotive applications. It features a small outline package style, operates b/w -40°C to 125°C, and supports surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,513 parts In-Stock

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8,513

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Digiode

USA . 3,391 parts In-Stock

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3,391

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Distributors (Availability)

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One Stop Electronics

USA . 1,625 parts In-Stock

1+ parts

$3.500

100+ parts

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1,625

$3.500

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Ampacity Inc.

Singapore . 590 parts In-Stock

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$5.500

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590

$5.500

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Parana Technologies

USA . 1,998 parts In-Stock

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$5.985

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$6.761

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1,998

$5.985

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$6.761

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DigiPath Technology Company

USA . 595 parts In-Stock

1+ parts

$6.590

100+ parts

$6.063

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595

$6.590

$6.063

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ChromeModa Solutions

Germany . 6,341 parts In-Stock

1+ parts

$6.725

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$5.514

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6,341

$6.725

$5.514

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IDEA Electronic Components Group

UK . 2,027 parts In-Stock

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$6.725

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$6.052

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2,027

$6.725

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$6.052

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AZTECH Wire

Italy . 504 parts In-Stock

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$7.318

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504

$7.318

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Semicontronic

India . 825 parts In-Stock

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$7.500

100+ parts

$7.312

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$7.275

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825

$7.500

$7.312

$7.275

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Corphita

USA . 3,668 parts In-Stock

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3,668

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Microchip USA

USA . 278 parts In-Stock

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Corohmni

South Africa . 172 parts In-Stock

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Overview

Experience innovation and quality with the Texas Instruments PAMC1304M25DW. As a leader in semiconductor technology, Texas Instruments delivers unmatched reliability and performance. This small outline package is ideal for automotive applications, offering a wide supply voltage range and dual terminal position for versatility. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations, setting new standards in the industry. Elevate your projects with the PAMC1304M25DW and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and fits well in many electronic designs.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a standard in many applications, providing compatibility with existing systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for high-density layouts.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments without issues.

Terminal Position: DUAL

The dual terminal position provides flexibility in mounting and connection options.

Width (mm): 7.5 mm

The compact width of 7.5mm allows for space-efficient designs.

Other IC type: ANALOG CIRCUIT

The analog circuit IC type enables precise signal processing and control in analog applications.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources.

Length: 10.3 mm

The length of 10.3mm is suitable for compact electronic designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the product can withstand the temperature fluctuations in automotive environments.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during installation.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections on the circuit board.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V enables the product to operate within a wide voltage range.

Technical Specifications

Other Function Semiconductors PAMC1304M25DW attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 15 V FOR LDO

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

PAMC1304M25DW Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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