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PADS131B26QPHPRQ1

Texas Instruments

PADS131B26QPHPRQ1 by Texas Instruments

PADS131B26QPHPRQ1 by Texas Instruments is a 48-terminal chip carrier with AEC-Q100 screening. It operates b/w -40°C to 125°C, suitable for automotive applications. With 6 channels and GULL WING terminals, it supports a supply voltage range of 2.9V to 16V in a compact 7mm square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,860 parts In-Stock

1+ parts

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3,860

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Digiode

USA . 1,706 parts In-Stock

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1,706

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 210 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

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210

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,175 parts In-Stock

1+ parts

$4.500

100+ parts

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1,175

$4.500

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Ampacity Inc.

Singapore . 269 parts In-Stock

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$6.500

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269

$6.500

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AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$18.180

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607

$18.180

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Corphita

USA . 4,807 parts In-Stock

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4,807

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Corohmni

South Africa . 83 parts In-Stock

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Overview

Discover the high-quality PADS131B26QPHPRQ1 by Texas Instruments, a versatile solution in the category of Other Function Semiconductors. This innovative product offers customers incredible value and benefits with its wide range of applications, from analog circuits to automotive electronics. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this chip carrier with gull wing terminals will exceed your expectations in performance and reliability. Upgrade your projects with the PADS131B26QPHPRQ1 and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the semiconductor components, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality standards, making this product suitable for automotive applications where reliability is crucial.

Package Shape: SQUARE

The square package shape offers a compact design, making it easier to integrate into systems with limited space.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and the ability to interface with multiple components and circuits.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and space-saving design, enhancing the overall performance of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 to 125°C ensures reliable performance in extreme temperature conditions.

Terminal Position: QUAD

The quad terminal position provides secure and stable connection points, ensuring reliable signal transmission and functionality.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for a compact and space-efficient design, ideal for applications where size constraints are a concern.

Width (mm): 7 mm

With a width of 7mm, this product is well-suited for applications where a compact form factor is required.

Other IC type: ANALOG CIRCUIT

Being designed with an analog circuit allows for precise and accurate signal processing, making this product suitable for applications that require high-performance analog functionality.

Minimum Supply Voltage (Vsup): 2.9 V

The low minimum supply voltage of 2.9V ensures efficient power consumption and compatibility with a wide range of power sources.

Length: 7 mm

With a length of 7mm, this product offers a compact and space-saving design for applications where size is a critical factor.

No. of Channels: 6

Having 6 channels provides flexibility and versatility in signal processing and data transmission, making this product suitable for applications that require multiple channels.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical stability and secure soldering connections, ensuring reliable performance in various operating conditions.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product allows for high-density mounting on PCBs, saving space and enabling efficient circuit design.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage of 16V provides flexibility and compatibility with a wide range of power sources, making this product versatile for various applications.

Minimum Input Voltage: -0.3 V

The ability to accept a minimum input voltage of -0.3V allows for enhanced functionality and compatibility with different signal sources.

Maximum Input Voltage: 2.4 V

With a maximum input voltage of 2.4V, this product can handle a wide range of input signals, ensuring reliable operation in diverse application scenarios.

Technical Specifications

Other Function Semiconductors PADS131B26QPHPRQ1 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

2.4 V

Minimum Input Voltage:

-.3 V

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

PADS131B26QPHPRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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