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OPT3006YMFT

Texas Instruments

OPT3006YMFT by Texas Instruments

The Texas Instruments OPT3006YMFT is a surface-mount chip carrier with 6 terminals and a nominal voltage of 3.3V. It operates in industrial temperatures from -40 to 85°C, making it suitable for analog circuit applications. With a compact size of 0.946mm x 0.856mm x 0.226mm, it is ideal for space-constrained designs requiring precise light sensing capabilities.

Median Price

$2.190

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 970 parts In-Stock

1+ parts

$2.190

100+ parts

$1.608

1k+ parts

$1.442

10k+ parts

-

970

$2.190

$1.608

$1.442

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$0.999

-

-

-

Digiode

USA . 3,320 parts In-Stock

1+ parts

$2.746

100+ parts

-

1k+ parts

-

10k+ parts

-

3,320

$2.746

-

-

-

Vyrian

USA . 855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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855

-

-

-

-

Zilex Electronics Inc.

Canada . 544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

544

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,297 parts In-Stock

1+ parts

$0.993

100+ parts

-

1k+ parts

-

10k+ parts

$0.973

4,297

$0.993

-

-

$0.973

Argo Parts USA

USA . 3,064 parts In-Stock

1+ parts

$0.993

100+ parts

-

1k+ parts

-

10k+ parts

-

3,064

$0.993

-

-

-

Ampacity Inc.

Singapore . 813 parts In-Stock

1+ parts

$1.860

100+ parts

-

1k+ parts

-

10k+ parts

-

813

$1.860

-

-

-

Corphita

USA . 3,913 parts In-Stock

1+ parts

$2.601

100+ parts

-

1k+ parts

-

10k+ parts

-

3,913

$2.601

-

-

-

Parana Technologies

USA . 1,771 parts In-Stock

1+ parts

$20.474

100+ parts

-

1k+ parts

$20.533

10k+ parts

-

1,771

$20.474

-

$20.533

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DigiPath Technology Company

USA . 2,218 parts In-Stock

1+ parts

$22.544

100+ parts

$20.740

1k+ parts

-

10k+ parts

-

2,218

$22.544

$20.740

-

-

IDEA Electronic Components Group

UK . 1,407 parts In-Stock

1+ parts

$23.004

100+ parts

$21.854

1k+ parts

$20.704

10k+ parts

-

1,407

$23.004

$21.854

$20.704

-

ChromeModa Solutions

Germany . 1,314 parts In-Stock

1+ parts

$23.004

100+ parts

$18.863

1k+ parts

-

10k+ parts

-

1,314

$23.004

$18.863

-

-

Overview

Experience the cutting-edge technology of the OPT3006YMFT by Texas Instruments, a high-quality sensor that offers unmatched precision and reliability. Crafted by industry leader Texas Instruments, this sensor is perfect for a wide range of applications in the semiconductor field. With its surface mount design and compact package shape, this sensor is easy to integrate into any project. Discover the value and benefits that this innovative product brings to your work, providing accurate readings and seamless performance. Trust Texas Instruments for top-of-the-line products that deliver exceptional results every time.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal supply voltage for stable and reliable performance.

No. of Terminals: 6

Provides multiple connection points for increased functionality and versatility.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for various industrial applications.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures without compromising performance.

Terminal Finish: COPPER NICKEL PALLADIUM

Durable terminal finish for a long-lasting and reliable connection.

Width (mm): 0.856 mm

Compact width for space-saving design and easy integration into tight spaces.

Other IC type: ANALOG CIRCUIT

Offers analog circuit capabilities for precise and accurate signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for soldering without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering processes.

Temperature Grade: INDUSTRIAL

Designed for industrial environments with a wide temperature range for operation.

Terminal Pitch: 0.35 mm

Close terminal pitch for efficient connections and reduced signal interference.

Maximum Supply Voltage (Vsup): 3.6 V

Can handle high supply voltages for versatile applications.

Technical Specifications

Other Function Semiconductors OPT3006YMFT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-XBCC-B6

Length:

.946 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.226 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

COPPER NICKEL PALLADIUM

Terminal Form:

BUTT

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

.856 mm

Trade Compliance

OPT3006YMFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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