Loading...

OPA857TD2

Texas Instruments

OPA857TD2 by Texas Instruments

The Texas Instruments OPA857TD2 is an Operational Amplifier with a max input offset voltage of 10000 uV and nominal unity gain bandwidth of 130000 kHz. This surface-mount chip, suitable for industrial applications, operates b/w -40 to 85 °C and comes in a rectangular package style with 15 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,631

-

-

-

-

Digiode

USA . 1,708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,708

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 164 parts In-Stock

1+ parts

$1.455

100+ parts

-

1k+ parts

$2.142

10k+ parts

-

164

$1.455

-

$2.142

-

DigiPath Technology Company

USA . 1,987 parts In-Stock

1+ parts

$1.602

100+ parts

-

1k+ parts

-

10k+ parts

-

1,987

$1.602

-

-

-

ChromeModa Solutions

Germany . 5,371 parts In-Stock

1+ parts

$1.635

100+ parts

$1.341

1k+ parts

-

10k+ parts

-

5,371

$1.635

$1.341

-

-

IDEA Electronic Components Group

UK . 1,571 parts In-Stock

1+ parts

$1.635

100+ parts

-

1k+ parts

$1.472

10k+ parts

-

1,571

$1.635

-

$1.472

-

One Stop Electronics

USA . 768 parts In-Stock

1+ parts

$6.410

100+ parts

-

1k+ parts

-

10k+ parts

-

768

$6.410

-

-

-

AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$14.789

100+ parts

-

1k+ parts

-

10k+ parts

-

304

$14.789

-

-

-

Microchip USA

USA . 1,260 parts In-Stock

1+ parts

$46.050

100+ parts

$45.390

1k+ parts

$45.060

10k+ parts

$44.730

1,260

$46.050

$45.390

$45.060

$44.730

Component Stockers USA

USA . 764 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

764

$99.990

-

-

-

Corphita

USA . 2,108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,108

-

-

-

-

Overview

Experience unparalleled performance and reliability with the OPA857TD2 by Texas Instruments. This operational amplifier is designed to meet the highest standards of quality, making it ideal for a wide range of applications in industries such as automotive, industrial, and telecommunications. With its superior design and precision engineering, this op amp offers customers unmatched value and benefits, providing them with the competitive edge they need to succeed in today's demanding market. Trust Texas Instruments for all your operational amplifier needs and experience the difference in quality and performance.

Feature Benefit Bullets

Maximum Input Offset Voltage: 10000 uV

Low input offset voltage ensures accurate and precise signal processing, making this operational amplifier suitable for high-precision applications.

Surface Mount: YES

Surface mount package allows for easy and convenient mounting on circuit boards, simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard board layouts and allows for efficient use of space on the PCB.

No. of Terminals: 15

Large number of terminals offer versatile connectivity options and enable complex circuit designs.

Package Style (Meter): UNCASED CHIP

Uncased chip style simplifies integration into custom housing or designs, providing flexibility in the final product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in both extreme cold and hot environments, increasing product versatility.

Terminal Position: UPPER

Upper terminal position facilitates easy access for connections and soldering during assembly.

Width: 0.785 mm

Small width dimension enables compact circuit designs and saves space on the PCB, ideal for applications with size constraints.

Length: 0.807 mm

Compact length dimension complements the narrow width, further contributing to space-saving design options.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, making this op amp suitable for rugged applications.

Nominal Unity Gain Bandwidth: 130000 kHz

High unity gain bandwidth allows for the amplification of high-frequency signals with minimal distortion, making this op amp suitable for broadband applications.

Terminal Form: NO LEAD

No lead terminal form simplifies surface mount soldering process and reduces the risk of damage during handling, enhancing the product's durability.

Amplifier Type: OPERATIONAL AMPLIFIER

Designed specifically as an operational amplifier, providing excellent performance characteristics for various signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) OPA857TD2 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

130 MHz

Input Offset Voltage Limit:

10000 uV

Operational Characteristics

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.032 in (0.807 mm)

Width:

0.031 in (0.785 mm)

Total Terminals:

15

Terminal Position:

Upper

Terminal Form:

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-XUUC-N15

Packaging and Shipping

Package Code:

DIE

Package Shape:

Package Style:

Uncased Chip

Trade Compliance

OPA857TD2 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20