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OPA695IDBVRG4

Texas Instruments

OPA695IDBVRG4 by Texas Instruments

Texas Instruments OPA695IDBVRG4 is an Operational Amplifier with 4000uV Max Input Offset Voltage, 30uA Max Average Bias Current, and 1100 V/us Min Slew Rate. Ideal for industrial applications requiring high-speed amplification in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 19,600 parts In-Stock

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19,600

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Vyrian

USA . 6,475 parts In-Stock

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6,475

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Digiode

USA . 4,042 parts In-Stock

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4,042

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Martec Srl

Italy . 82 parts In-Stock

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Zilex Electronics Inc.

Canada . 80 parts In-Stock

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80

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Distributors (Availability)

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Corohmni

South Africa . 800 parts In-Stock

1+ parts

$3.818

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800

$3.818

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Ampacity Inc.

Singapore . 1,203 parts In-Stock

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$4.410

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1,203

$4.410

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Parana Technologies

USA . 284 parts In-Stock

1+ parts

$6.178

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$6.945

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284

$6.178

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$6.945

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Semicontronic

India . 1,039 parts In-Stock

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$6.410

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$6.250

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$6.218

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1,039

$6.410

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$6.218

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One Stop Electronics

USA . 576 parts In-Stock

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$6.410

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576

$6.410

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DigiPath Technology Company

USA . 761 parts In-Stock

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$6.803

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$6.259

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761

$6.803

$6.259

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ChromeModa Solutions

Germany . 6,524 parts In-Stock

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$6.942

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$5.692

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6,524

$6.942

$5.692

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IDEA Electronic Components Group

UK . 368 parts In-Stock

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$6.942

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$6.248

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368

$6.942

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$6.248

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AZTECH Wire

Italy . 236 parts In-Stock

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$7.499

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236

$7.499

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A-Z Elektronik GmbH

Germany . 9,190 parts In-Stock

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Continental Prestige Electronics

USA . 5,351 parts In-Stock

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Kepictronics

USA . 3,121 parts In-Stock

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Corphita

USA . 2,722 parts In-Stock

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Microchip USA

USA . 1,292 parts In-Stock

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Argo Parts USA

USA . 662 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Perfect Parts

USA . 92 parts In-Stock

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92

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Overview

Discover the unparalleled performance and precision of the OPA695IDBVRG4 by Texas Instruments. Crafted with expertise and innovation, this operational amplifier is ideal for a wide range of applications where high accuracy and reliability are crucial. From industrial automation to medical devices, this compact yet powerful component delivers exceptional results, ensuring smooth operation and optimal functionality. Elevate your projects with the superior quality and performance of the OPA695IDBVRG4, setting new standards in operational amplifiers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier, ensuring long-term reliability.

Maximum Input Offset Voltage: 4000 uV

Low input offset voltage helps in minimizing errors in signal processing applications, resulting in accurate output.

Maximum Average Bias Current (IIB): 30 uA

Low bias current ensures minimal input current draw, leading to efficient power consumption.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB design, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 56 dB

High common mode rejection ratio helps in reducing noise and interference in the input signal, improving the overall signal quality.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a common supply voltage, making it compatible with a wide range of applications.

No. of Terminals: 6

Provides versatile connectivity options for input and output signals, enhancing flexibility in circuit design.

Minimum Slew Rate: 1100 V/us

Fast slew rate enables rapid response to input voltage changes, ideal for high-speed signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) OPA695IDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

Yes

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1700 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

56 dB

Minimum Common Mode Rejection Ratio (CMRR ):

51 dB

Input Offset Voltage Limit:

4000 uV

Minimum Slew Rate:

1100 V/us

Nominal Slew Rate:

2900 V/us

Peak Bias Current:

30 uA

Maximum Bias Current (IIB) @25 °C:

30 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.5 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-6.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

13.3 mA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

6

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Low Profile, Shrink Pitch

Trade Compliance

OPA695IDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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