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OPA657NB/3K

Texas Instruments

OPA657NB/3K by Texas Instruments

OPA657NB/3K by Texas Instruments is a low-offset operational amplifier with a max input offset voltage of 900uV and nominal common mode reject ratio of 79dB. With a wideband architecture and high voltage gain, it is ideal for industrial applications requiring precise signal amplification in compact spaces. The amplifier operates within a temperature range of -40 to 85°C and has low bias current for efficient power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,737 parts In-Stock

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5,737

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Digiode

USA . 1,303 parts In-Stock

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1,303

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.663

100+ parts

$0.630

1k+ parts

$0.630

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1,000

$0.663

$0.630

$0.630

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Ampacity Inc.

Singapore . 461 parts In-Stock

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$1.410

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461

$1.410

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Semicontronic

India . 147 parts In-Stock

1+ parts

$1.410

100+ parts

$1.375

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$1.368

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147

$1.410

$1.375

$1.368

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One Stop Electronics

USA . 368 parts In-Stock

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$2.410

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368

$2.410

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Corohmni

South Africa . 52 parts In-Stock

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$3.889

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$3.889

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Parana Technologies

USA . 2,019 parts In-Stock

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$5.880

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$6.664

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$5.880

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$6.664

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IDEA Electronic Components Group

UK . 867 parts In-Stock

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$6.607

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$5.946

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867

$6.607

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$5.946

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ChromeModa Solutions

Germany . 730 parts In-Stock

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$6.607

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$5.418

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730

$6.607

$5.418

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AZTECH Wire

Italy . 609 parts In-Stock

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$13.458

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Continental Prestige Electronics

USA . 4,619 parts In-Stock

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Corphita

USA . 4,189 parts In-Stock

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DigiPath Technology Company

USA . 2,129 parts In-Stock

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$5.957

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Argo Parts USA

USA . 1,962 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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$0.150

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$0.150

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$0.150

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Microchip USA

USA . 128 parts In-Stock

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Overview

Unlock unparalleled performance and precision with the Texas Instruments OPA657NB/3K operational amplifier. Crafted with top-quality materials and cutting-edge technology, this op amp delivers exceptional results across a wide range of applications. From industrial automation to medical devices, this small outline, low-profile package offers low offset, low bias, and high bandwidth for optimal performance. Experience unmatched reliability and efficiency with the OPA657NB/3K and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this operational amplifier lightweight and durable.

Maximum Input Offset Voltage: 900 uV

With a low maximum input offset voltage of 900 uV, this op amp ensures accurate and precise signal processing.

Maximum Average Bias Current (IIB): 0.00125 uA

The low maximum average bias current of 0.00125 uA helps in reducing power consumption and improving efficiency.

Surface Mount: YES

Being surface mount compatible makes this op amp easy to install and suitable for compact circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic systems.

Nominal Common Mode Reject Ratio: 79 dB

The high nominal common mode reject ratio of 79 dB ensures reliable performance in rejecting common mode noise.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this op amp is suitable for a wide range of applications.

Power Supplies (V): +-5

The dual power supply capability of +-5V allows for flexibility in powering the op amp.

No. of Terminals: 5

The 5 terminals provide ample interface options for connecting to external components.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style saves space on the PCB and enhances portability.

Technical Specifications

Operational Amplifiers (Op Amps) OPA657NB/3K attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

YES (AVCL>=7)

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1600 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

79 dB

Input Offset Voltage Limit:

900 uV

Minimum Voltage Gain:

1410

Nominal Slew Rate:

700 V/us

Peak Bias Current:

1.25 nA

Maximum Bias Current (IIB) @25 °C:

5 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.5 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-6.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

16.3 mA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

OPA657NB/3K Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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