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OPA567AIRHGTG4

Texas Instruments

OPA567AIRHGTG4 by Texas Instruments

OPA567AIRHGTG4 by Texas Instruments is a voltage-feedback operational amplifier with 2000uV max input offset voltage, 80dB nominal CMRR, and 1200kHz unity gain bandwidth. Ideal for military applications due to its low-bias current of 0.00001uA and operating temperature range from -55 to 125 °C. This Op Amp comes in a square chip carrier package with very thin profile, making it suitable for compact designs requiring high precision amplification.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 9,117 parts In-Stock

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Vyrian

USA . 3,493 parts In-Stock

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3,493

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Digiode

USA . 1,030 parts In-Stock

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1,030

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Nova Conductors

Japan . 50 parts In-Stock

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50

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PC Components Company LLC

USA . 20 parts In-Stock

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20

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Bristol Electronics

USA . 4 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,957 parts In-Stock

1+ parts

$1.005

100+ parts

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$1.884

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1,957

$1.005

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$1.884

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DigiPath Technology Company

USA . 1,651 parts In-Stock

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$1.106

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$1.018

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$1.106

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ChromeModa Solutions

Germany . 4,574 parts In-Stock

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$1.129

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$0.926

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$1.129

$0.926

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IDEA Electronic Components Group

UK . 19 parts In-Stock

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$1.129

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$1.016

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19

$1.129

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Ampacity Inc.

Singapore . 1,073 parts In-Stock

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$4.410

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$4.410

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One Stop Electronics

USA . 252 parts In-Stock

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$4.410

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$4.410

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AZTECH Wire

Italy . 263 parts In-Stock

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$15.312

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Corphita

USA . 4,956 parts In-Stock

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Microchip USA

USA . 2,539 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Bastille Electronics

Australia . 700 parts In-Stock

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Overview

Elevate your electronics with the OPA567AIRHGTG4 by Texas Instruments, a cutting-edge operational amplifier designed for precision and reliability. Crafted with top-quality materials and advanced technology, this amplifier offers superior performance in a compact package, making it ideal for a wide range of applications. From audio equipment to industrial automation systems, this amplifier delivers exceptional value and efficiency, providing customers with the power and accuracy they need to bring their projects to life. Experience the difference with the OPA567AIRHGTG4 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage ensures accurate and precise signal processing.

Maximum Average Bias Current (IIB): 0.00001 uA

Low bias current results in minimal power consumption and improved efficiency.

Surface Mount: YES

Surface mount capability allows for easy and quick installation on PCBs.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio helps in eliminating noise and interference from the input signal.

Nominal Supply Voltage / Vsup (V): 5

Operates on a standard supply voltage of 5V, making it compatible with a wide range of applications.

No. of Terminals: 12

Sufficient number of terminals for connecting external components and interfacing with other circuitry.

Maximum Supply Voltage Limit: 7.5 V

Ensures the device is protected from voltage spikes, increasing its reliability and lifespan.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliable performance in various environmental conditions.

Frequency Compensation: YES

Integrated frequency compensation enhances stability and prevents oscillations in the circuit.

Minimum Voltage Gain: 100000

High minimum voltage gain ensures amplification of weak signals without distortion.

Power: YES

Power-efficient design with low supply current consumption.

Temperature Grade: MILITARY

Designed to meet stringent military standards for ruggedness and reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design provides high gain and accurate signal processing capabilities.

Technical Specifications

Operational Amplifiers (Op Amps) OPA567AIRHGTG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

Yes

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

60 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

100000

Nominal Slew Rate:

1.2 V/us

Maximum Input Offset Current (IIO):

10 pA

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7.5 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

6 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.197 in (5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Total Terminals:

12

Terminal Pitch:

0.039 in (1 mm)

Terminal Position:

Quad

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Equivalence Code:

LCC12,.2SQ,20

Trade Compliance

OPA567AIRHGTG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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