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OPA4703EA/250G4

Texas Instruments

OPA4703EA/250G4 by Texas Instruments

OPA4703EA/250G4 by Texas Instruments is a CMOS operational amplifier with low-offset and low-bias features. It has a max input offset voltage of 750uV, operates at temperatures from -40 to 85 °C, and offers a nominal unity gain bandwidth of 1000 kHz. Ideal for industrial applications requiring micropower amplification in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,595 parts In-Stock

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8,595

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Digiode

USA . 4,151 parts In-Stock

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4,151

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Distributors (Availability)

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One Stop Electronics

USA . 274 parts In-Stock

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$1.410

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274

$1.410

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Parana Technologies

USA . 1,477 parts In-Stock

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$2.750

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$3.235

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1,477

$2.750

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$3.235

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ChromeModa Solutions

Germany . 1,730 parts In-Stock

1+ parts

$3.090

100+ parts

$2.534

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1,730

$3.090

$2.534

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IDEA Electronic Components Group

UK . 92 parts In-Stock

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$3.090

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$2.781

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92

$3.090

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$2.781

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AZTECH Wire

Italy . 484 parts In-Stock

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$8.255

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484

$8.255

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Corphita

USA . 4,378 parts In-Stock

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Microchip USA

USA . 2,353 parts In-Stock

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DigiPath Technology Company

USA . 750 parts In-Stock

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$2.786

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750

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$2.786

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Perfect Parts

USA . 633 parts In-Stock

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633

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Overview

Unleash the power of precision with the Texas Instruments OPA4703EA/250G4 operational amplifier. Crafted with top-notch quality and expertise, this device offers unmatched performance in a variety of applications. Whether you're designing audio equipment or industrial machinery, this op amp delivers reliability and accuracy like no other. Experience the value of ultra-low bias current, micropower efficiency, and high common mode rejection ratio. Elevate your projects with the cutting-edge technology of Texas Instruments and redefine what's possible in the world of operational amplifiers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and offers good protection for the internal components of the operational amplifier.

Nominal Common Mode Reject Ratio: 90 dB

High common mode rejection ratio ensures that the amplifier can effectively reject noise and interference from the input signal.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V allows for compatibility with a wide range of systems and applications.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making this operational amplifier suitable for battery-powered devices and high-impedance circuits.

Amplifier Type: OPERATIONAL AMPLIFIER

Being a dedicated operational amplifier, this product is optimized for linear signal amplification with high gain and precision.

Technical Specifications

Operational Amplifiers (Op Amps) OPA4703EA/250G4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2/±6/4/12 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

750 uV

Minimum Voltage Gain:

63100

Nominal Slew Rate:

0.6 V/us

Maximum Input Offset Current (IIO):

10 pA

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.6 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-6.6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

800 μA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

OPA4703EA/250G4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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