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OPA3832IPWR

Texas Instruments

OPA3832IPWR by Texas Instruments

OPA3832IPWR by Texas Instruments is a 14-terminal operational amplifier with a small outline package. It features a max seated height of 1.2mm, operates at an industrial temperature grade, and utilizes bipolar technology. Ideal for applications requiring high-performance amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,240

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-

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Digiode

USA . 1,365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,365

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 611 parts In-Stock

1+ parts

$5.488

100+ parts

-

1k+ parts

$6.220

10k+ parts

-

611

$5.488

-

$6.220

-

DigiPath Technology Company

USA . 1,009 parts In-Stock

1+ parts

$6.043

100+ parts

-

1k+ parts

-

10k+ parts

-

1,009

$6.043

-

-

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ChromeModa Solutions

Germany . 2,228 parts In-Stock

1+ parts

$6.166

100+ parts

$5.056

1k+ parts

-

10k+ parts

-

2,228

$6.166

$5.056

-

-

IDEA Electronic Components Group

UK . 979 parts In-Stock

1+ parts

$6.166

100+ parts

-

1k+ parts

$5.549

10k+ parts

-

979

$6.166

-

$5.549

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One Stop Electronics

USA . 1,608 parts In-Stock

1+ parts

$6.410

100+ parts

-

1k+ parts

-

10k+ parts

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1,608

$6.410

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AZTECH Wire

Italy . 842 parts In-Stock

1+ parts

$8.150

100+ parts

-

1k+ parts

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10k+ parts

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842

$8.150

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-

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Component Stockers USA

USA . 501 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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501

$99.990

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Corphita

USA . 2,437 parts In-Stock

1+ parts

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100+ parts

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2,437

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Microchip USA

USA . 370 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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370

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Overview

Unlock the potential of your next project with the OPA3832IPWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality operational amplifiers (Op Amps) that deliver exceptional performance and reliability. With its innovative design and versatile applications, this amplifier offers unparalleled value and benefits to customers. Whether you're designing audio equipment, industrial controls, or communication systems, the OPA3832IPWR provides the precision and efficiency you need to bring your ideas to life. Choose Texas Instruments for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good insulation properties, making the product safe to use in various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 3

Having multiple functions in one component enhances functionality and versatility in circuit design.

Package Shape: RECTANGULAR

Rectangular shape provides uniformity and ease of integration into standard PCB layouts.

No. of Terminals: 14

More terminals allow for a greater number of connections and configurations, increasing flexibility in circuit design.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish ensures good conductivity and corrosion resistance, enhancing product reliability.

Maximum Seated Height: 1.2 mm

Low seated height enables compact and slim designs, ideal for space-constrained applications.

Width: 4.4 mm

A narrow width helps in saving PCB real estate and allows for denser circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during soldering process, ensuring proper bonding.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables reliable soldering and assembly in different manufacturing environments.

Length: 5 mm

Compact length contributes to overall space-efficient design and integration within electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures stable performance in harsh operating conditions.

Technology: BIPOLAR

Bipolar technology provides precise and accurate amplification for various signal processing applications.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide mechanical strength, improving overall durability of the product.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design offers high gain, stability, and precision, suitable for a wide range of analog signal processing tasks.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting, making it suitable for compact circuit designs.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates the product can withstand a moderate level of moisture exposure, ensuring reliability in different environmental conditions.

Technical Specifications

Operational Amplifiers (Op Amps) OPA3832IPWR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

3

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

OPA3832IPWR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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