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OPA3832IDR

Texas Instruments

OPA3832IDR by Texas Instruments

OPA3832IDR by Texas Instruments is a 3-function operational amplifier with a small outline package style. It features a rectangular shape, dual terminal position, and industrial temperature grade. With bipolar technology and gull wing terminal form, it is suitable for various applications requiring precise amplification in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,380

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-

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Digiode

USA . 2,072 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,072

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,609 parts In-Stock

1+ parts

$0.823

100+ parts

-

1k+ parts

$1.793

10k+ parts

-

1,609

$0.823

-

$1.793

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DigiPath Technology Company

USA . 977 parts In-Stock

1+ parts

$0.906

100+ parts

-

1k+ parts

-

10k+ parts

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977

$0.906

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-

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ChromeModa Solutions

Germany . 1,781 parts In-Stock

1+ parts

$0.925

100+ parts

$0.758

1k+ parts

-

10k+ parts

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1,781

$0.925

$0.758

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IDEA Electronic Components Group

UK . 234 parts In-Stock

1+ parts

$0.925

100+ parts

-

1k+ parts

$0.832

10k+ parts

-

234

$0.925

-

$0.832

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One Stop Electronics

USA . 338 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

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10k+ parts

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338

$3.410

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$8.949

100+ parts

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559

$8.949

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Microchip USA

USA . 11,940 parts In-Stock

1+ parts

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11,940

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Perfect Parts

USA . 633 parts In-Stock

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633

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Corphita

USA . 152 parts In-Stock

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152

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Overview

Elevate your design with the high-quality OPA3832IDR operational amplifier by Texas Instruments. With a reputation for excellence in the industry, Texas Instruments delivers cutting-edge technology and reliability. These Op Amps are versatile and ideal for a wide range of applications, offering customers unmatched performance and precision. Experience the value and benefits of the OPA3832IDR, designed to meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the operational amplifier, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable, this operational amplifier can be easily integrated onto a circuit board, allowing for compact design and efficient use of space.

No. of Functions: 3

With three functions packed into one component, this operational amplifier offers versatility and flexibility in circuit design, saving space and cost.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and secure mounting of the operational amplifier onto a circuit board, simplifying the assembly process.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for the operational amplifier, enabling the device to be easily integrated into complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the portability and space-saving aspect of the operational amplifier, making it suitable for compact electronic devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures high reliability and conductivity, contributing to the overall performance and longevity of the operational amplifier.

Terminal Position: DUAL

The dual terminal position allows for easy connection and secure attachment of the operational amplifier onto a circuit board, ensuring stable operation and reduced risk of signal loss.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm enables the operational amplifier to be easily accommodated in compact electronic devices, facilitating space-constrained designs.

Width: 3.9 mm

The compact width of 3.9 mm contributes to the slim profile of the operational amplifier, allowing for streamlined integration into electronic circuitry with limited space.

Maximum Time At Peak Reflow Temperature (s): 30

The operational amplifier can withstand a maximum time of 30 seconds at peak reflow temperature (260°C), ensuring reliability during soldering and assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the operational amplifier can endure high-temperature environments and soldering procedures without compromising its performance.

Length: 8.65 mm

The moderate length of 8.65 mm contributes to the overall compactness and versatility of the operational amplifier, making it suitable for various electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the operational amplifier can withstand harsh environmental conditions and temperature variations, making it suitable for industrial applications.

Technology: BIPOLAR

Utilizing bipolar technology, this operational amplifier offers high precision, low noise, and fast response characteristics, making it ideal for applications requiring high performance and accuracy.

Terminal Form: GULL WING

The gull wing terminal form provides secure attachment and reliable connectivity for the operational amplifier, ensuring stable operation and reduced risk of signal interference.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this component is specifically designed for amplifying and processing electrical signals with high accuracy and efficiency, making it a versatile choice for various signal processing applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and secure placement of the operational amplifier on a circuit board, facilitating reliable connections and optimal signal transmission.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this operational amplifier is suitable for storage and operation in moderate humidity environments, ensuring long-term reliability and performance.

Technical Specifications

Operational Amplifiers (Op Amps) OPA3832IDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

3

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

OPA3832IDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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