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OPA373AIDG4

Texas Instruments

OPA373AIDG4 by Texas Instruments

OPA373AIDG4 by Texas Instruments is an Operational Amplifier with 5000uV Max Input Offset Voltage, 90dB CMRR, and 6500kHz Unity Gain Bandwidth. Ideal for automotive applications due to its low-bias, micropower design, and high common mode rejection ratio.

Median Price

$1.460

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 583 parts In-Stock

1+ parts

$1.460

100+ parts

$1.010

1k+ parts

$0.842

10k+ parts

$0.589

583

$1.460

$1.010

$0.842

$0.589

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,183 parts In-Stock

1+ parts

$1.387

100+ parts

-

1k+ parts

-

10k+ parts

-

4,183

$1.387

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Vyrian

USA . 4,711 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

-

4,711

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 29 parts In-Stock

1+ parts

$1.240

100+ parts

-

1k+ parts

$2.018

10k+ parts

-

29

$1.240

-

$2.018

-

Corphita

USA . 3,434 parts In-Stock

1+ parts

$1.314

100+ parts

-

1k+ parts

-

10k+ parts

-

3,434

$1.314

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-

-

ChromeModa Solutions

Germany . 3,447 parts In-Stock

1+ parts

$1.393

100+ parts

$1.142

1k+ parts

-

10k+ parts

-

3,447

$1.393

$1.142

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IDEA Electronic Components Group

UK . 1,801 parts In-Stock

1+ parts

$1.393

100+ parts

-

1k+ parts

$1.254

10k+ parts

-

1,801

$1.393

-

$1.254

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Microchip USA

USA . 2,857 parts In-Stock

1+ parts

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2,857

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Perfect Parts

USA . 2,156 parts In-Stock

1+ parts

-

100+ parts

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2,156

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DigiPath Technology Company

USA . 2,100 parts In-Stock

1+ parts

-

100+ parts

$1.256

1k+ parts

-

10k+ parts

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2,100

-

$1.256

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Overview

Enhance your electronic designs with the OPA373AIDG4 by Texas Instruments, a high-quality operational amplifier perfect for a wide range of applications. Crafted by a trusted manufacturer, this Op Amp offers unparalleled performance and reliability. With its low bias current, micropower technology, and impressive common mode reject ratio, this amplifier delivers exceptional value and efficiency to customers. Whether you're designing automotive electronics or precision instrumentation, the OPA373AIDG4 provides the power and precision you need for your projects. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the op amp, making it suitable for various environments and applications.

Maximum Input Offset Voltage: 5000 uV

Low input offset voltage ensures accurate and precise signal processing, making the op amp ideal for applications requiring high precision.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 90 dB

High common mode rejection ratio helps in minimizing noise and interference from the common mode signals, resulting in clean output signals.

Maximum Operating Temperature: 125 °C

High operating temperature range allows the op amp to function reliably even in harsh environments or conditions.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making the op amp suitable for low-power applications and high impedance circuits.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is versatile and can be used in a wide range of applications including signal conditioning, filtering, and amplification.

Technical Specifications

Operational Amplifiers (Op Amps) OPA373AIDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

6.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Minimum Common Mode Rejection Ratio (CMRR ):

66 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

5 V/us

Maximum Input Offset Current (IIO):

10 pA

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

800 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

OPA373AIDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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