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OPA3684IDBQR

Texas Instruments

OPA3684IDBQR by Texas Instruments

Texas Instruments OPA3684IDBQR is a 16-terminal operational amplifier (Op Amp) with 3 functions. It features a small outline package style, dual terminal position, and industrial temperature grade. Ideal for applications requiring bipolar technology and precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,264 parts In-Stock

1+ parts

-

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6,264

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Digiode

USA . 715 parts In-Stock

1+ parts

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-

1k+ parts

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715

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,386 parts In-Stock

1+ parts

$5.937

100+ parts

-

1k+ parts

$6.720

10k+ parts

-

1,386

$5.937

-

$6.720

-

IDEA Electronic Components Group

UK . 1,993 parts In-Stock

1+ parts

$6.671

100+ parts

-

1k+ parts

$6.004

10k+ parts

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1,993

$6.671

-

$6.004

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ChromeModa Solutions

Germany . 1,862 parts In-Stock

1+ parts

$6.671

100+ parts

$5.470

1k+ parts

-

10k+ parts

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1,862

$6.671

$5.470

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-

One Stop Electronics

USA . 195 parts In-Stock

1+ parts

$9.410

100+ parts

-

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195

$9.410

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AZTECH Wire

Italy . 782 parts In-Stock

1+ parts

$13.325

100+ parts

-

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10k+ parts

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782

$13.325

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A-Z Elektronik GmbH

Germany . 4,983 parts In-Stock

1+ parts

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4,983

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Corphita

USA . 3,595 parts In-Stock

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3,595

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Microchip USA

USA . 3,576 parts In-Stock

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3,576

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DigiPath Technology Company

USA . 2,310 parts In-Stock

1+ parts

-

100+ parts

$6.015

1k+ parts

-

10k+ parts

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2,310

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$6.015

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Overview

Unleash the power of precision with the Texas Instruments OPA3684IDBQR operational amplifier. Designed for industrial-grade applications, this small outline op amp offers unmatched quality and reliability. With three functions packed into one tiny package, this amplifier delivers superior performance in a compact design. Whether you're working on audio equipment, medical devices, or sensor systems, the OPA3684IDBQR provides the value and benefits you need to take your project to the next level. Trust Texas Instruments for top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

No. of Functions: 3

Having multiple functions in one component reduces the need for additional components, simplifies circuit design, and improves overall system efficiency.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and allows for easy placement on circuit boards, optimizing layout design.

No. of Terminals: 16

Having a high number of terminals offers versatility in circuit connections and allows for complex signal routing, making the product suitable for diverse applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on circuit boards, enables high-density mounting, and improves overall system performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit configuration and enables easy connection to external components, enhancing usability and versatility.

Maximum Seated Height: 1.75 mm

Low maximum seated height allows for compact design and efficient use of space, making the product suitable for applications with size constraints.

Width: 3.9 mm

Narrow width contributes to space-saving design, allows for tight circuit layouts, and enables integration in compact electronic devices.

Length: 4.9 mm

Compact length facilitates installation in constrained spaces, supports miniaturization of electronic systems, and enhances overall product efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments, making the product suitable for industrial and automotive applications.

Technology: BIPOLAR

Bipolar technology offers high precision, low noise, and excellent stability, making the product ideal for high-performance applications requiring accurate signal processing.

Terminal Form: GULL WING

Gull wing terminal form facilitates soldering and ensures secure electrical connections, enhancing reliability and ease of assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design provides high gain, stability, and accuracy, making the product suitable for a wide range of signal processing and amplification applications.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for precise connections, enables high-density packaging, and supports high-speed signal transmission, enhancing overall system performance.

Technical Specifications

Operational Amplifiers (Op Amps) OPA3684IDBQR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

3

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

16

Terminal Pitch:

0.025 in (0.635 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Trade Compliance

OPA3684IDBQR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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