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OPA357AIDDARG3

Texas Instruments

OPA357AIDDARG3 by Texas Instruments

OPA357AIDDARG3 by Texas Instruments is an Operational Amplifier (Op Amp) with a small outline package and dual terminal position. It features CMOS technology, matte tin terminal finish, and automotive temperature grade suitability. Ideal for applications requiring high precision amplification in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,643 parts In-Stock

1+ parts

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7,643

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Digiode

USA . 4,898 parts In-Stock

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4,898

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,306 parts In-Stock

1+ parts

$2.410

100+ parts

-

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1,306

$2.410

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Parana Technologies

USA . 490 parts In-Stock

1+ parts

$4.948

100+ parts

-

1k+ parts

$5.487

10k+ parts

-

490

$4.948

-

$5.487

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DigiPath Technology Company

USA . 2,198 parts In-Stock

1+ parts

$5.448

100+ parts

$5.012

1k+ parts

-

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2,198

$5.448

$5.012

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ChromeModa Solutions

Germany . 1,033 parts In-Stock

1+ parts

$5.559

100+ parts

$4.558

1k+ parts

-

10k+ parts

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1,033

$5.559

$4.558

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IDEA Electronic Components Group

UK . 706 parts In-Stock

1+ parts

$5.559

100+ parts

-

1k+ parts

$5.003

10k+ parts

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706

$5.559

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$5.003

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AZTECH Wire

Italy . 560 parts In-Stock

1+ parts

$10.350

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560

$10.350

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Corphita

USA . 1,454 parts In-Stock

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1,454

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Microchip USA

USA . 183 parts In-Stock

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183

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Overview

Elevate your electronic designs with the OPA357AIDDARG3 by Texas Instruments, a top-quality operational amplifier that delivers unmatched performance and reliability. Manufactured by a trusted leader in the industry, this product is perfect for a wide range of applications in automotive and industrial settings. With its compact size and advanced technology, the OPA357AIDDARG3 offers customers exceptional value, high precision, and superior functionality. Upgrade your projects today with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the operational amplifier.

Surface Mount: YES

Being surface mount enables easy and efficient installation of the operational amplifier onto circuit boards, making it suitable for automated production processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy alignment and placement on the circuit board, optimizing space and ensuring proper connectivity.

No. of Terminals: 8

With 8 terminals, this operational amplifier offers flexibility in connecting to other components within the circuit, allowing for versatile design possibilities.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

The small outline, heat sink/slug, low profile package style allows for efficient heat dissipation and compact design, making it suitable for space-constrained applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and resistance to corrosion, ensuring reliable electrical connections and longevity of the operational amplifier.

Temperature Grade: AUTOMOTIVE

Being automotive grade means this operational amplifier is designed to withstand harsh environmental conditions, making it suitable for automotive applications where durability is crucial.

Technology: CMOS

The CMOS technology used in this operational amplifier offers low power consumption, high input impedance, and excellent noise performance, making it energy-efficient and ideal for sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering, ensuring reliable performance and efficient manufacturing processes.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier means this product is specifically designed for high-gain, differential input and can be used for a wide range of analog signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) OPA357AIDDARG3 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.193 in (4.89 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.066 in (1.68 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Low Profile

Trade Compliance

OPA357AIDDARG3 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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