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OPA357AIDBVRG4

Texas Instruments

OPA357AIDBVRG4 by Texas Instruments

Texas Instruments OPA357AIDBVRG4 is a CMOS Operational Amplifier with 6 terminals in a small outline package. It has a low profile design, dual terminal position, and nickel palladium gold finish. Ideal for automotive applications due to its compact size, high temperature tolerance up to 260°C, and moisture sensitivity level of 2.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,647 parts In-Stock

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4,647

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Chip Stock

USA . 2,675 parts In-Stock

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2,675

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Digiode

USA . 2,418 parts In-Stock

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2,418

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Bristol Electronics

USA . 542 parts In-Stock

1+ parts

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542

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 288 parts In-Stock

1+ parts

$0.647

100+ parts

-

1k+ parts

-

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288

$0.647

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One Stop Electronics

USA . 521 parts In-Stock

1+ parts

$1.410

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-

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521

$1.410

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Parana Technologies

USA . 1,565 parts In-Stock

1+ parts

$1.810

100+ parts

$168.110

1k+ parts

$1.629

10k+ parts

-

1,565

$1.810

$168.110

$1.629

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DigiPath Technology Company

USA . 165 parts In-Stock

1+ parts

$1.993

100+ parts

$1.834

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-

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165

$1.993

$1.834

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ChromeModa Solutions

Germany . 2,311 parts In-Stock

1+ parts

$2.034

100+ parts

$1.668

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2,311

$2.034

$1.668

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IDEA Electronic Components Group

UK . 2,086 parts In-Stock

1+ parts

$2.034

100+ parts

-

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$1.831

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2,086

$2.034

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$1.831

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Semicontronic

India . 900 parts In-Stock

1+ parts

$5.410

100+ parts

$5.275

1k+ parts

$5.248

10k+ parts

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900

$5.410

$5.275

$5.248

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AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$6.900

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437

$6.900

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Ampacity Inc.

Singapore . 446 parts In-Stock

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$7.410

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446

$7.410

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A-Z Elektronik GmbH

Germany . 11,427 parts In-Stock

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Kepictronics

USA . 4,110 parts In-Stock

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Corphita

USA . 3,719 parts In-Stock

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Argo Parts USA

USA . 2,229 parts In-Stock

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2,229

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Continental Prestige Electronics

USA . 990 parts In-Stock

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990

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Perfect Parts

USA . 616 parts In-Stock

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616

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Microchip USA

USA . 473 parts In-Stock

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473

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Overview

Unleash the power of precision and reliability with the OPA357AIDBVRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch operational amplifiers that excel in a wide range of applications. With a compact package style and advanced technology, this op amp offers unmatched performance and versatility. Whether you're working on automotive projects or industrial applications, the OPA357AIDBVRG4 provides the high-quality solution you need for your circuit designs. Elevate your projects to new heights with this exceptional product from Texas Instruments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

This feature allows for easy installation and saves space on the circuit board.

Package Shape: RECTANGULAR

The rectangular shape is efficient for installation and fits easily on a circuit board.

No. of Terminals: 6

With 6 terminals, this product offers versatility and compatibility with different systems.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This style provides a compact design and efficient use of space on the circuit board.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish ensures reliable and stable connections for improved performance.

Terminal Position: DUAL

The dual terminal position allows for flexibility and ease of connection in various setups.

Maximum Seated Height: 1.45 mm

The low seated height makes this product suitable for compact designs and space-constrained applications.

Width: 1.6 mm

The narrow width of the product allows for easy integration into different circuit board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for a specified time, ensuring durability during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the product's reliability in various operating conditions.

Length: 2.9 mm

The compact length of the product contributes to space-saving and efficient circuit board layout.

Temperature Grade: AUTOMOTIVE

This product is designed to withstand extreme temperature conditions, making it ideal for automotive applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during installation.

Amplifier Type: OPERATIONAL AMPLIFIER

This type of amplifier is versatile and widely used in various electronic applications.

Terminal Pitch: 0.95 mm

The small terminal pitch allows for high-density mounting and efficient use of space on the circuit board.

Moisture Sensitivity Level (MSL): 2

This product has a moderate moisture sensitivity level, suitable for various environmental conditions.

Technical Specifications

Operational Amplifiers (Op Amps) OPA357AIDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

6

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Trade Compliance

OPA357AIDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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