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OPA336UG4

Texas Instruments

OPA336UG4 by Texas Instruments

OPA336UG4 by Texas Instruments is an Operational Amplifier with low-offset and low-bias features. It has a max input offset voltage of 125uV, nominal voltage of 5V, and a min voltage gain of 31600. Ideal for industrial applications requiring precise signal amplification in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,742 parts In-Stock

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Digiode

USA . 2,060 parts In-Stock

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2,060

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 654 parts In-Stock

1+ parts

$0.693

100+ parts

-

1k+ parts

$1.731

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654

$0.693

-

$1.731

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ChromeModa Solutions

Germany . 6,836 parts In-Stock

1+ parts

$0.779

100+ parts

$0.639

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6,836

$0.779

$0.639

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IDEA Electronic Components Group

UK . 913 parts In-Stock

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$0.779

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$0.701

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913

$0.779

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$0.701

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One Stop Electronics

USA . 375 parts In-Stock

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$4.410

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375

$4.410

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AZTECH Wire

Italy . 863 parts In-Stock

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$17.537

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863

$17.537

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A-Z Elektronik GmbH

Germany . 2,433 parts In-Stock

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Microchip USA

USA . 2,153 parts In-Stock

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Corphita

USA . 1,128 parts In-Stock

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DigiPath Technology Company

USA . 1,007 parts In-Stock

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$0.702

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$0.702

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Perfect Parts

USA . 874 parts In-Stock

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874

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Overview

Unlock the power of precision with the OPA336UG4 operational amplifier by Texas Instruments. Designed with top-notch quality and cutting-edge technology, this op amp delivers unparalleled performance in a compact package. Ideal for a wide range of applications, from industrial automation to medical devices, this amplifier offers low offset, low bias, and micropower capabilities. Trust Texas Instruments to provide you with the reliability and value you need for your next project. Elevate your designs with the OPA336UG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the operational amplifier, ensuring reliable performance over time.

Maximum Input Offset Voltage: 125 uV

Low input offset voltage helps in minimizing errors in signal processing and ensures accurate amplification.

Maximum Average Bias Current (IIB): 0.00006 uA

Low bias current results in lower power consumption and improved signal fidelity in the amplifier circuit.

Surface Mount: YES

Surface mount capability allows for easy integration into compact electronic designs, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 90 dB

High common mode rejection ratio helps in reducing noise and interference from the input signal, leading to cleaner output signals.

Maximum Supply Voltage Limit: 7.5 V

Having a higher supply voltage limit provides flexibility in power supply options and allows for a wider range of applications for the operational amplifier.

Frequency Compensation: YES

Frequency compensation ensures stability in the amplifier circuit, preventing oscillations and improving overall performance.

Minimum Voltage Gain: 31600

High minimum voltage gain ensures strong amplification capability, making this operational amplifier suitable for applications requiring high gain.

Temperature Grade: INDUSTRIAL

Industrial temperature grade allows the operational amplifier to operate effectively in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making this operational amplifier efficient and versatile in various circuit designs.

Technical Specifications

Operational Amplifiers (Op Amps) OPA336UG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

2.5/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

100 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

125 uV

Minimum Voltage Gain:

31600

Nominal Slew Rate:

0.03 V/us

Maximum Input Offset Current (IIO):

10 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

36 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

OPA336UG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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