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OPA2832IDGKR

Texas Instruments

OPA2832IDGKR by Texas Instruments

OPA2832IDGKR by Texas Instruments is a dual operational amplifier with 8 terminals in a small outline, thin profile package. It features bipolar technology, 0.65 mm terminal pitch, and industrial temperature grade. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,076 parts In-Stock

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6,076

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Digiode

USA . 3,581 parts In-Stock

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3,581

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Distributors (Availability)

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Parana Technologies

USA . 371 parts In-Stock

1+ parts

$0.698

100+ parts

-

1k+ parts

$1.734

10k+ parts

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371

$0.698

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$1.734

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IDEA Electronic Components Group

UK . 2,038 parts In-Stock

1+ parts

$0.784

100+ parts

-

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$0.706

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2,038

$0.784

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$0.706

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ChromeModa Solutions

Germany . 1,762 parts In-Stock

1+ parts

$0.784

100+ parts

$0.643

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1,762

$0.784

$0.643

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Advanced Electronics

New Zealand . 1,200 parts In-Stock

1+ parts

$5.525

100+ parts

$5.470

1k+ parts

$5.249

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1,200

$5.525

$5.470

$5.249

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One Stop Electronics

USA . 1,532 parts In-Stock

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$6.410

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1,532

$6.410

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AZTECH Wire

Italy . 847 parts In-Stock

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$19.237

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847

$19.237

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A-Z Elektronik GmbH

Germany . 5,777 parts In-Stock

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5,777

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Corphita

USA . 1,908 parts In-Stock

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1,908

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DigiPath Technology Company

USA . 1,404 parts In-Stock

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100+ parts

$0.707

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1,404

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$0.707

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Microchip USA

USA . 104 parts In-Stock

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104

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Overview

Unleash the power of precision with the OPA2832IDGKR by Texas Instruments. As a leader in operational amplifiers, Texas Instruments delivers unmatched quality and reliability. This dual-function Op Amp in a small outline package is perfect for industrial applications that require high performance in a compact design. Experience superior signal processing and enhanced functionality with the OPA2832IDGKR, providing customers with unparalleled value and efficiency in their projects. Elevate your designs with Texas Instruments' innovative technology and maximize your results with this top-of-the-line operational amplifier.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort in assembly.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional components, saving space and simplifying circuit design.

Package Shape: SQUARE

The square shape allows for easy placement and alignment on the circuit board, optimizing space usage and layout.

No. of Terminals: 8

Having more terminals provides flexibility in connecting to other components, allowing for versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style saves space on the circuit board, making it ideal for designs with limited real estate.

Terminal Position: DUAL

Having dual terminal positions allows for easy connection options, making installation and circuit layout more convenient.

Maximum Seated Height: 1.1 mm

The low seated height enables a slim and compact design, suitable for applications with height restrictions.

Width: 3 mm

The small width allows for efficient use of space on the circuit board, especially in designs with tight constraints.

Length: 3 mm

The small length contributes to a compact overall footprint, making the product suitable for compact electronics applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in a wide range of temperature environments, making it suitable for industrial applications.

Technology: BIPOLAR

Bipolar technology offers high precision and performance characteristics, making the product suitable for applications that require accuracy and stability.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure connections, ensuring reliable electrical contact.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier provides amplification and signal processing capabilities, making the product versatile and suitable for a variety of electronic applications.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting on the circuit board, maximizing component placement efficiency.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2832IDGKR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

OPA2832IDGKR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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