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OPA277AIDRMTG4

Texas Instruments

OPA277AIDRMTG4 by Texas Instruments

OPA277AIDRMTG4 by Texas Instruments is an operational amplifier with a max input offset voltage of 165uV, low bias current of 0.004uA, and high common mode rejection ratio of 140dB. Ideal for industrial applications requiring precise signal amplification in a compact package with micropower consumption.

Median Price

$5.700

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 159 parts In-Stock

1+ parts

$5.700

100+ parts

$2.679

1k+ parts

$2.565

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159

$5.700

$2.679

$2.565

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Vyrian

USA . 5,584 parts In-Stock

1+ parts

-

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5,584

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ACDS - Activité Composants Distribution Service

France . 159 parts In-Stock

1+ parts

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159

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Dan-Mar Components

USA . 159 parts In-Stock

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159

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Digiode

USA . 54 parts In-Stock

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54

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,447 parts In-Stock

1+ parts

$0.410

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-

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1,447

$0.410

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Parana Technologies

USA . 934 parts In-Stock

1+ parts

$5.293

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$5.921

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934

$5.293

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$5.921

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IDEA Electronic Components Group

UK . 1,753 parts In-Stock

1+ parts

$5.947

100+ parts

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$5.352

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1,753

$5.947

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$5.352

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ChromeModa Solutions

Germany . 516 parts In-Stock

1+ parts

$5.947

100+ parts

$4.877

1k+ parts

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516

$5.947

$4.877

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AZTECH Wire

Italy . 809 parts In-Stock

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$13.363

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809

$13.363

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Microchip USA

USA . 2,424 parts In-Stock

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Corphita

USA . 2,231 parts In-Stock

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DigiPath Technology Company

USA . 998 parts In-Stock

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$5.362

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998

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$5.362

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Overview

Experience unparalleled precision and performance with the OPA277AIDRMTG4 by Texas Instruments, a leading manufacturer in the industry. Ideal for applications requiring high accuracy and reliability, this operational amplifier offers low input offset voltage and bias current, ensuring optimal signal integrity. Its compact package design and wide supply voltage range make it versatile for various industrial uses. Trust Texas Instruments to deliver exceptional quality and value with the OPA277AIDRMTG4, setting new standards in operational amplifier technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package is durable and lightweight, making the op amp easy to handle and mount in various applications.

Maximum Input Offset Voltage: 165 uV

Low input offset voltage ensures high accuracy in signal processing applications, providing precise and reliable results.

Maximum Average Bias Current (IIB): 0.004 uA

Low bias current helps in minimizing power consumption and improving overall efficiency of the op amp circuit.

Surface Mount: YES

Surface mount capability makes it easy to integrate this op amp into compact electronic designs, saving space and facilitating automated assembly.

Nominal Common Mode Reject Ratio: 140 dB

High common mode rejection ratio ensures that the op amp effectively suppresses unwanted noise and interference in the input signal.

Nominal Supply Voltage / Vsup (V): 15

Suitable supply voltage range allows for versatile use in a variety of applications, providing consistent performance.

Power Supplies (V): +-2/+-18

Wide range of power supply voltage options offers flexibility and compatibility with different power sources.

No. of Terminals: 8

Adequate number of terminals enable easy connectivity and integration with external circuitry, enhancing the versatility of the op amp.

Minimum Slew Rate: 0.8 V/us

Fast slew rate allows the op amp to quickly respond to changes in input signals, making it suitable for dynamic applications like audio amplification.

Frequency Compensation: YES

Frequency compensation ensures stability and prevents oscillations in the op amp circuit, enhancing overall performance and reliability.

Minimum Voltage Gain: 1995000

High voltage gain capability enables the op amp to amplify weak signals effectively, making it ideal for applications requiring signal amplification.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise operation, making the op amp suitable for sensitive measurement and instrumentation applications.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is designed for various analog signal processing tasks such as amplification, filtering, and signal conditioning.

Technical Specifications

Operational Amplifiers (Op Amps) OPA277AIDRMTG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±2/±18 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

140 dB

Minimum Common Mode Rejection Ratio (CMRR ):

130 dB

Input Offset Voltage Limit:

165 uV

Minimum Voltage Gain:

1995000

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

0.8 V/us

Maximum Input Offset Current (IIO):

2.8 nA

Peak Bias Current:

4 nA

Maximum Bias Current (IIB) @25 °C:

2.8 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

900 μA

Physical Characteristics

Length:

0.157 in (4 mm)

Width:

0.157 in (4 mm)

Maximum Seated Height:

0.039 in (1 mm)

Total Terminals:

8

Terminal Pitch:

0.031 in (0.8 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Equivalence Code:

SOLCC8,.15,32

Trade Compliance

OPA277AIDRMTG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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