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OPA2695IDG4

Texas Instruments

OPA2695IDG4 by Texas Instruments

OPA2695IDG4 by Texas Instruments is a dual operational amplifier with 8 terminals in a small outline package. It features a max seated height of 1.75mm, operates at an industrial temperature grade, and utilizes bipolar technology. This op amp is suitable for applications requiring precise signal amplification in compact electronic devices.

Median Price

$2.775

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 108 parts In-Stock

1+ parts

$2.770

100+ parts

$2.710

1k+ parts

$2.660

10k+ parts

-

108

$2.770

$2.710

$2.660

-

DigiKey

USA . 108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.780

10k+ parts

-

108

-

-

$2.780

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,926 parts In-Stock

1+ parts

$2.536

100+ parts

-

1k+ parts

-

10k+ parts

-

1,926

$2.536

-

-

-

Vyrian

USA . 5,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,587

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,254 parts In-Stock

1+ parts

$2.403

100+ parts

-

1k+ parts

-

10k+ parts

-

3,254

$2.403

-

-

-

Parana Technologies

USA . 2,109 parts In-Stock

1+ parts

$3.258

100+ parts

-

1k+ parts

$3.782

10k+ parts

-

2,109

$3.258

-

$3.782

-

ChromeModa Solutions

Germany . 6,184 parts In-Stock

1+ parts

$3.661

100+ parts

$3.002

1k+ parts

-

10k+ parts

-

6,184

$3.661

$3.002

-

-

IDEA Electronic Components Group

UK . 317 parts In-Stock

1+ parts

$3.661

100+ parts

-

1k+ parts

$3.295

10k+ parts

-

317

$3.661

-

$3.295

-

Perfect Parts

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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874

-

-

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DigiPath Technology Company

USA . 47 parts In-Stock

1+ parts

-

100+ parts

$3.301

1k+ parts

-

10k+ parts

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47

-

$3.301

-

-

Overview

Unleash the power of precision with the OPA2695IDG4 by Texas Instruments! Crafted with superior quality and expertise, this operational amplifier offers unparalleled performance in a compact package. Ideal for a wide range of applications, this dual-function op amp is designed to provide customers with exceptional value and reliability. Elevate your projects with the OPA2695IDG4 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable and long-lasting.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and providing a more stable connection.

No. of Functions: 2

Having two functions in one component can save space on the circuit board and simplify the overall design.

Package Shape: RECTANGULAR

The rectangular shape is standard and compatible with most PCB layouts, making it easy to integrate into existing designs.

No. of Terminals: 8

Having multiple terminals allows for more connectivity options and flexibility in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact electronic designs.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Terminal Position: DUAL

Having dual terminal positions allows for more versatile mounting options and greater flexibility in circuit layouts.

Maximum Seated Height: 1.75 mm

The low profile of this product makes it suitable for applications with height constraints, such as slim electronic devices.

Width: 3.9 mm

The compact width of the product saves space on the PCB and allows for more components to be placed in a limited area.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient assembly of the product, saving time and reducing manufacturing costs.

Peak Reflow Temperature °C: 260

This high reflow temperature allows for reliable soldering and ensures the product can withstand the rigors of assembly processes.

Length: 4.9 mm

The small length of the product saves space on the PCB and allows for a more compact overall design.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges means the product can operate in harsh environments and withstand extreme temperatures.

Technology: BIPOLAR

Bipolar technology offers high performance and precision, making the product suitable for applications requiring accurate signal processing.

Terminal Form: GULL WING

The gull wing terminal form is suitable for surface mounting and provides a secure connection, enhancing the reliability of the product.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and widely used in various electronic circuits, making this product suitable for a wide range of applications.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy integration into existing designs and compatibility with common PCB layouts.

Moisture Sensitivity Level (MSL): 2

Having a low moisture sensitivity level means the product is less prone to moisture-induced damage, ensuring reliable performance in various environments.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2695IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

2

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

OPA2695IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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