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OPA2684IDCNRG4

Texas Instruments

OPA2684IDCNRG4 by Texas Instruments

OPA2684IDCNRG4 by Texas Instruments is a dual operational amplifier with 8 terminals in a small outline package. It features a max seated height of 1.45mm, suitable for industrial temperature grades. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,755 parts In-Stock

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9,755

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Digiode

USA . 3,812 parts In-Stock

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3,812

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Distributors (Availability)

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One Stop Electronics

USA . 1,072 parts In-Stock

1+ parts

$5.410

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1,072

$5.410

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Parana Technologies

USA . 1,383 parts In-Stock

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$6.040

100+ parts

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$6.818

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1,383

$6.040

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$6.818

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DigiPath Technology Company

USA . 798 parts In-Stock

1+ parts

$6.651

100+ parts

$6.119

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798

$6.651

$6.119

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ChromeModa Solutions

Germany . 1,682 parts In-Stock

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$6.787

100+ parts

$5.565

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1,682

$6.787

$5.565

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IDEA Electronic Components Group

UK . 264 parts In-Stock

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$6.787

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$6.108

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264

$6.787

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$6.108

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AZTECH Wire

Italy . 458 parts In-Stock

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$10.188

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458

$10.188

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Component Stockers USA

USA . 745 parts In-Stock

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$99.990

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745

$99.990

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Corphita

USA . 2,581 parts In-Stock

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Microchip USA

USA . 408 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the OPA2684IDCNRG4 operational amplifiers. Designed for industrial applications, this small outline, low profile amplifier offers dual functions in a compact rectangular package. With Texas Instruments' cutting-edge technology and expertise, you can trust in the precision and performance of this product. Experience seamless integration and enhanced functionality with the OPA2684IDCNRG4, setting new standards in operational amplifier excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package material provides durability and protection for the internal components of the operational amplifier, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the operational amplifier onto a circuit board, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having two functions in a single operational amplifier component allows for versatility and flexibility in circuit design, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard mounting configurations and ensures easy integration into existing circuit layouts.

No. of Terminals: 8

With 8 terminals, this operational amplifier offers multiple connection points for external components, enabling complex circuit designs and signal processing capabilities.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Small outline, low profile, shrink pitch package style enhances space efficiency and allows for dense circuit board layouts, making it ideal for compact electronic devices.

Terminal Position: DUAL

Dual terminal position provides flexibility in wiring configurations and facilitates easy connection to external components, ensuring convenience in circuit assembly and maintenance.

Maximum Seated Height: 1.45 mm

Low maximum seated height allows for a slim profile and compact design, making this operational amplifier suitable for applications where space constraints are a concern.

Width: 1.6 mm

Narrow width dimension contributes to the overall compactness of the operational amplifier, enabling it to be used in small form factor devices without compromising performance.

Length: 2.9 mm

Short length dimension further enhances the space-saving potential of this operational amplifier, making it a practical choice for applications with limited board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation over a wide temperature range, making this operational amplifier suitable for demanding industrial applications that require robust performance in harsh environments.

Technology: BIPOLAR

Bipolar technology provides high precision and low noise performance, making this operational amplifier suitable for applications that require accurate signal processing and amplification.

Terminal Form: GULL WING

Gull wing terminal form enables easy surface mount soldering and reliable electrical connections, ensuring secure attachment to the circuit board for stable operation.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this component offers high gain and stability for linear signal amplification, making it a versatile choice for various analog signal processing applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for precise connections and facilitates high-density mounting, enabling efficient circuit designs with reduced footprint, ideal for space-constrained applications.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2684IDCNRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Trade Compliance

OPA2684IDCNRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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