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OPA2684IDCNR

Texas Instruments

OPA2684IDCNR by Texas Instruments

Texas Instruments OPA2684IDCNR is a dual operational amplifier with 8 terminals in a small outline package. It features bipolar technology, 0.65 mm terminal pitch, and industrial temperature grade. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,425 parts In-Stock

1+ parts

-

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5,425

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Digiode

USA . 97 parts In-Stock

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97

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,330 parts In-Stock

1+ parts

$2.410

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1,330

$2.410

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Parana Technologies

USA . 1,454 parts In-Stock

1+ parts

$4.703

100+ parts

-

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$5.190

10k+ parts

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1,454

$4.703

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$5.190

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ChromeModa Solutions

Germany . 6,736 parts In-Stock

1+ parts

$5.284

100+ parts

$4.333

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6,736

$5.284

$4.333

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IDEA Electronic Components Group

UK . 1,460 parts In-Stock

1+ parts

$5.284

100+ parts

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$4.756

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1,460

$5.284

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$4.756

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One Stop Electronics

USA . 481 parts In-Stock

1+ parts

$7.410

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481

$7.410

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$14.771

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896

$14.771

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A-Z Elektronik GmbH

Germany . 5,168 parts In-Stock

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5,168

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Corphita

USA . 4,235 parts In-Stock

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Argo Parts USA

USA . 3,047 parts In-Stock

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3,047

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DigiPath Technology Company

USA . 1,541 parts In-Stock

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$4.764

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1,541

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$4.764

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Continental Prestige Electronics

USA . 1,167 parts In-Stock

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1,167

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 878 parts In-Stock

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878

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Microchip USA

USA . 119 parts In-Stock

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119

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Overview

Enhance your projects with the OPA2684IDCNR by Texas Instruments, a top-quality operational amplifier that offers unparalleled performance and reliability. Manufactured by a trusted industry leader, this product is perfect for a wide range of applications in the electronics field. With its compact design and advanced technology, the OPA2684IDCNR delivers exceptional value and benefits to customers, making it an essential component for any project requiring precision and efficiency. Upgrade your circuits today with the OPA2684IDCNR and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides lightweight and durable packaging for the operational amplifier, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mount compatible allows for easier and more efficient PCB assembly, saving time and effort during production.

No. of Functions: 2

Having multiple functions integrated into one component simplifies circuit design and reduces overall component count, saving board space and cost.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and alignment on the circuit board, improving overall design flexibility.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options and allows for a wider range of circuit configurations and applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch style of the package makes it space-efficient and suitable for compact designs.

Terminal Position: DUAL

The dual terminal position allows for easier connection and routing of signals within the circuit, improving overall signal integrity.

Maximum Seated Height: 1.45 mm

The low maximum seated height ensures that the operational amplifier can be used in applications with height restrictions while maintaining optimal performance.

Width: 1.6 mm

The compact width of the amplifier makes it suitable for applications where board space is limited or where multiple components need to be placed closely together.

Length: 2.9 mm

The short length of the amplifier allows for easy integration into tight spaces or compact designs without compromising functionality.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, the operational amplifier can withstand a wide range of operating temperatures, making it suitable for industrial applications.

Technology: BIPOLAR

The bipolar technology used in the amplifier ensures high precision and low noise performance, making it ideal for applications where accuracy is critical.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering onto the PCB, ensuring reliable connections and minimizing the risk of mechanical failure.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is designed for high-performance amplification and signal processing applications, offering precision and stability.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density board designs and allows for closer placement of components, reducing signal interference and improving overall performance.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2684IDCNR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Trade Compliance

OPA2684IDCNR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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