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OPA2683IDR

Texas Instruments

OPA2683IDR by Texas Instruments

OPA2683IDR by Texas Instruments is a dual operational amplifier with 8 terminals in a small outline package. It features bipolar technology, gull wing terminal form, and industrial temperature grade. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,530 parts In-Stock

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8,530

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Digiode

USA . 2,137 parts In-Stock

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2,137

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Nova Conductors

Japan . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,042 parts In-Stock

1+ parts

$3.947

100+ parts

-

1k+ parts

$4.418

10k+ parts

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2,042

$3.947

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$4.418

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DigiPath Technology Company

USA . 2,037 parts In-Stock

1+ parts

$4.346

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-

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2,037

$4.346

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ChromeModa Solutions

Germany . 2,879 parts In-Stock

1+ parts

$4.435

100+ parts

$3.637

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2,879

$4.435

$3.637

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IDEA Electronic Components Group

UK . 217 parts In-Stock

1+ parts

$4.435

100+ parts

-

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$3.992

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217

$4.435

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$3.992

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Ampacity Inc.

Singapore . 1,243 parts In-Stock

1+ parts

$5.410

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1,243

$5.410

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One Stop Electronics

USA . 926 parts In-Stock

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$5.410

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926

$5.410

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AZTECH Wire

Italy . 576 parts In-Stock

1+ parts

$14.585

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576

$14.585

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A-Z Elektronik GmbH

Germany . 6,249 parts In-Stock

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6,249

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Corphita

USA . 4,937 parts In-Stock

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4,937

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Argo Parts USA

USA . 4,555 parts In-Stock

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4,555

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Continental Prestige Electronics

USA . 3,488 parts In-Stock

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3,488

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Microchip USA

USA . 487 parts In-Stock

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487

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Kepictronics

USA . 121 parts In-Stock

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121

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Overview

Unlock the potential of your designs with the high-quality OPA2683IDR operational amplifiers by Texas Instruments. Made from top-notch materials and boasting exceptional performance, these Op Amps are perfect for a wide range of applications. With Texas Instruments' reputation for excellence and innovation, you can trust that this product will deliver superior results every time. Experience seamless integration, reliability, and precision like never before with the OPA2683IDR. Choose quality, choose value, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having 2 functions in one component saves space on the circuit board and reduces the need for additional components, simplifying the overall design.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily accommodated on standard circuit boards, making integration seamless.

No. of Terminals: 8

8 terminals provide multiple connection points for versatility in circuit configurations and ease of integration into various designs.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it ideal for compact designs and applications with limited space.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options and provides stability to ensure secure connections during operation.

Maximum Seated Height: 1.75 mm

Low seated height minimizes the overall profile of the component, making it suitable for slim and compact device designs.

Width: 3.9 mm

Narrow width dimension saves space on the circuit board, allowing for efficient use of available space in the design layout.

Length: 4.9 mm

Compact length dimension further contributes to a space-saving design, ideal for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environmental conditions, making it suitable for a wide range of applications.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise operation, making it ideal for applications that require accurate signal processing and amplification.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering during assembly, ensuring reliable performance in operation.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier type offers high gain and accuracy for signal amplification and processing, making it a versatile choice for various electronic applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy mounting and connection on standard circuit boards with compatible layouts, simplifying integration.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2683IDR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

OPA2683IDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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